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In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have. This particular Ishikawa Diagram displayed that reflow profile can have a large effect on voiding. Today I will dig into this area a bit further and talk about how we can minimize large ground plane solder voiding in electronic assemblywith differences in reflow profile.