IPC APEX EXPO 2016

Visit us at APEX 2016
Booth 3028

March 15-17, 2016
Las Vegas, NV

Avoid the Void

Featured Products

Indium10.1

Indium10.1 Solder Paste

Lowest Voiding Performance
No-Clean Pb-Free Solder Paste

  • Best-in-class no-clean performance:
    • QFN/BGA voiding resistance
    • Print transfer efficiency
    • Head-in-pillow resistance
    • Graping resistance
  • Excellent soldering performance to
    difficult-to-solder components and pad finishes

Additional Information

Indium8.9HF

Indium8.9HF Solder Paste

Halogen-Free No-Clean Solder Paste
 

  • Very low QFN and BGA voiding
  • Industry-leading performance across all key solder paste properties
  • Best-in-class printing performance
  • Unique oxidation barrier eliminates
    head-in-pillow and graping
  • Room temperature stable

Additional Information

Conference Presenters

Brook Sandy-Smith

Brook Sandy-Smith

PRESENTATION:

5-24A: Flux Specifications Task Group
Tue, Mar 15, 2016 - 1:30 PM to 3:00 PM

Event Type: Standards Development Committee Meeting
Topic/Track: Assembly Processes for Lead Free and Tin-Lead

Click here to add to your APEX schedule.

Cleanliness and ROHS Testing
Thu, Mar 17, 2016 - 9:00 AM to 10:00 AM

Event Type: Technical Conference Session
Topic/Track: Assembly Processes for Lead Free and Tin-Lead

Click here to add to your APEX schedule.

Eric Bastow

Eric Bastow

PRESENTATION:

Solder Paste Development
Tue, Mar 15, 2016 - 3:30 PM to 5:00 PM

Event Type: Technical Conference Session
Topic/Track: Assembly Processes for Lead Free and Tin-Lead

Click here to add to your APEX schedule.

Flux Reliability I
Wed, Mar 16, 2016 - 1:30 PM to 3:00 PM

Event Type: Technical Conference Session
Topic/Track: Quality, Reliability and Test

Click here to add to your APEX schedule.

Flux Reliability II
Thu, Mar 17, 2016 - 10:30 AM to 12:00 PM

Event Type: Technical Conference Session
Topic/Track: PCB Fabrication and Materials

Click here to add to your APEX schedule.

Dr. Ning-Cheng Lee

Dr. Ning-Cheng Lee

PRESENTATION:

Nano-Materials (for PCB Fabrication and Component Die Attach)
Thu, Mar 17, 2016 - 10:30 AM to 12:00 PM

Event Type: Technical Conference Session
Topic/Track: Emerging Technologies

Click here to add to your APEX schedule.

Product Preview

Indium Voiding Comparison

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas, Nev.

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 and Indium8.9HF solder pastes to reduce voiding significantly below the industry average for improved finished goods reliability. Read More...


Indium Voiding Comparison

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev.

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average ‐ for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects. Read More...

News Release

Service Excellence Award at IPC APEX 2016

Indium Corporation Receives CIRCUITS ASSEMBLY Service Excellence Award at IPC APEX 2016

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas, Nev.

The Service Excellence Awards recognize electronics manufacturing companies that, as judged by their own customers, demonstrate the highest performance across the areas of Technology, Responsiveness, Dependability, Quality, and Value for Price. Read More...


Indium Voiding Comparison

Indium Corporation Experts to Present at APEX 2016

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev.

Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance. Read More...


Indium's Mario Scalzo

Indium Corporation Products “Live@APEX”

Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo on March 15-17 in Las Vegas, Nev.

“Live@APEX,” a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations on the APEX show floor. Read More...

Videos

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