Next Generation Materials for Microelectronics
Indium Corporation manufactures next generation materials for microelectronics. These include:
- BiAgX®, a high temperature alloy
- LV Series of flux-coated preforms
- Gold-based solders
- Wafer-bumping fluxes
- Ball-attach fluxes
- Heat-Spring® thermal interface materials
BiAgX® is a patent-pending high-temperature alloy that was developed as a drop-in replacement for standard Pb-containing solder paste. It requires minimal process adjustments and no new capital expenditures. BiAgX is both Pb-free and Sb-free. BiAgX® is a solder paste-based technology; it is not an alloy. Its development was driven by legislative changes due to the reduction of RoHS exemptions.
BiAgX® is ideal for:
- Power semiconductor manufacturing
- Discrete passives
- Suppliers to the automotive industry, as well as automotive manufacturers
- Manufacturers for transportation and infrastructure
- Consumer electronics and mobile devices
For more details about this product, take a look at our technical papers. For questions, please contact Maria Durham at firstname.lastname@example.org.
LV-Series of Flux-Coated Preforms
Using a flux-coated solder preform instead of solder paste can help reduce voiding by up to 50%. In fact, many customers using flux-coated preforms have realized a significant drop in overall voiding.
Given the increasing performance requirements for electronics assemblies, customers are demanding products that can reduce voiding more than ever before. Simple techniques such as removing the solder paste and adding a solder preform are no longer sufficient. To meet this demand, Indium Corporation has developed the next generation of flux coatings. Our LV-series of flux coating is designed to not only reduce voiding, but has additional advantages as well.
- A uniform, repeatable coating - as low as 0.5% by weight
- Halide-free, meeting the ROL0 requirement without sacrificing strength
- A low residue gloss coating that does not clog pick & place nozzles
To request a product data sheet, or for more information about the LV-Series of flux coatings, please contact Seth Homer at email@example.com.
Gold and gold-containing alloys offer superior characteristics for a wide variety of applications where reliability and performance are crucial. As a near-brazing alloy with a tensile strength of 40,000psi, gold has excellent corrosion resistance, which sets it apart from any other soft solder. Pure gold is popular for medical applications because it is virtually inert in the body, while ensuring hermetic integrity.
As with many components, form factors are becoming smaller, making solder requirements more challenging. In the semiconductor industry, high-power die-attach applications require high yield, void free attachment. Indium Corporation's next generation of gold and gold-based preforms are engineered specifically to meet these requirements.
For more information about gold-based solders, contact Seth Homer at firstname.lastname@example.org.
For more information about wafer-bumping fluxes, contact Maria Durham at email@example.com.
Indium Corporation manufactures a variety of ball-attach fluxes suitable for pin-grid array and standard ball grid array applications. The ball-attach process for BGA and BGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while BGA fluxes are often very reactive no-clean materials.
For more information about ball-attach fluxes, contact Maria Durham at firstname.lastname@example.org.
Heat-Spring® Thermal Interface Materials
Indium Corporation has designed a full line of metal TIMS processed to form a uniform, highly conductive thermal interface. The Heat-Spring® offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our patented Heat-Spring® technology will further reduce the thermal resistance.
Heat-Springs® come in three varieties:
HSD or Heat-Spring® Classic is made for tight tolerance assemblies.
HSHP or Heat-Spring® Air uses the classic pattern, but has more depth for less than perfect interface surfaces.
HSK is the Heat-Spring® for Burn-In. It is a single-sided Heat-Spring® with a diffusion barrier for testing.
For more questions about Heat-Springs® contact Tim Jensen at email@example.com.
NanoFoil® is designed to give a nearly void-less bond at room temperature - without the need for flux. This process is referred to as NanoBonding®. Components see an extremely mild reflow profile, and the package doesn't have time to warp during the nearly instantaneous bond process.
NanoFoil® transfers heat as well as a conventional solder joint, making it an excellent thermal interface material. In addition, a NanoFoil® is ROHS-compliant and safe to use in cleanrooms.
For sensitive applications that require soldering with extreme precision and focus, consider NanoFoil®.
Applications that should consider NanoFoil® for NanoBonding® are:
For more information about NanoFoil® or NanoBonding® contact Seth Homer at firstname.lastname@example.org.
IMAPS 2013 Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Indium Corporation Blog Posts
Folks, The challenge of removing heat from electronics is almost as old as the 100 year old electronics industry. In modern electronics, most of the heat...
Application Engineers read data for trends - providing better long-term answers.
Solder preform washers placed onto the connector pin and reflowed along with solder paste can improve solder joint reliability, similar to the use of Solder Fortification.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.