Soldering Materials for SiP
Indium Corporation’s soldering materials for system-in-package (SiP) applications have a PROVEN track record with more than 1 billion SiP front-end module (FEM) SiP devices manufactured in the last 2 years using Indium Corporation materials.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP applications.
SiP Solder Pastes
- Applied usually by printing or jetting
- Reflow in inert atmosphere (typically
< 100ppm O2 level) - Compatible with SnAgCu, SnAg, SnSb, or other common Pb-free alloys
Wafer-Level or Panel-Level Package Fluxes
- Applied by printing onto wafer or panel using screen or stencil, followed by ball drop process
- Reflow in inert atmosphere (typically
< 100ppm O2 level) - Compatible with wide variety of passivation material
Ball-Attach Fluxes
- Applied by pin transfer or printing
- Reflow in air, but also suitable for use in reduced-oxygen atmosphere (typically
< 500ppm O2 level)
Flip-Chip Fluxes
- Applied by dipping or spraying
- Reflow in inert atmosphere (typically
< 50ppm O2 level) - Designed to be used in specific applications, from standard, large pitch solder bumps onto ENIG surfaces, to ultrafine pitch microbumps onto copper OSP, mass reflow, and TCB process
- Ultra-low residue no-clean fluxes with controlled solderability and compatible with wide variety of underfill materials
Wafer-Bumping Fluxes
- Applied by jetting or dispense, followed by spin coating to optimize film thickness
- Reflow in inert atmosphere (typically
< 20ppm O2 level) - Converts rough, non-spherical, plated or wafer probe-dented solder bumps into shiny hemispheres
- Proven applications include both copper-pillar microbumps and standard bumps
Soldering Materials for SiP Videos
-
SiP Materials (System-in-Package)
-
SiP Materials (System-in-Package)
-
Indium3.2HF Solder Paste
-
Ball-Attach Flux: WS-575-C-RT
-
No-Clean Fluxes in Semiconductor Assembly
Related Markets and Applications
Top Soldering Materials for SiP Technical Documents
Soldering Materials for SiP Technical Documents
Whitepapers
No whitepapers to display
Presentations
No presentations to display
Application Notes
No application notes to display
Product Data Sheets
No product data sheets to display
Safety Data Sheets
No safety data sheets to display
Soldering Materials for SiP Blog Posts
SiP Materials (System-in-Package) VIDEO
Let's explore the SiP process, especially the solder paste printing process...
Indium3.2HF Solder Paste for SIP Assembly
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller...
For comments or questions about the content on this page, please contact:
Sze Pei Lim
Regional Product Manager - Semiconductor
splim@indium.com
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2018. All Rights Reserved. | Site Map | Privacy Policies
Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.
Connect with Indium.
Read our latest posts!
Privacy Policy