Soldering Materials for SiP and IoT
As electronics products, such as wearables and mobile phones become increasingly smaller, and the Internet of Things (IoT) becomes more popular, the industry must pack more into a single module. This can lead to several challenges during assembly that can decrease yields and cause rework.
Indium Corporation offers a variety of products that are designed to achieve consistency and improve reliability in system-in-package (SiP) and IoT assembly.
3D Logic/Memory and Flip-Chip
Wafer Bumping (Bump Fusion) Flux
- Water-soluble
- Spin-on and jetting
- Halogen-free
Flip-Chip Flux
- Water-soluble, ultra-low residue, and no-clean
- Dipping, spraying, and jetting
- Halogen-free and halogenated
System-in-Package
Ultrafine-Pitch Solder Paste
- Water-soluble and ultra-low residue no-clean
- Halogen-free
Wafer-Level Ball-Attach Flux
- Water-soluble
- Halogen-free
Ball Grid Array
Ball-Attach Flux
- Water-soluble, ultra-low residue, and no-clean
- Pin transfer and printing
- Halogen-free
Soldering Materials for SiP and IoT Videos
-
SiP Materials (System-in-Package)
-
SiP Materials (System-in-Package)
-
Indium3.2HF Solder Paste
-
Ball-Attach Flux: WS-575-C-RT
-
No-Clean Fluxes in Semiconductor Assembly
Soldering Materials for SiP and IoT Technical Documents
Whitepapers
Presentations
No presentations to display
Application Notes
No application notes to display
Product Data Sheets
No product data sheets to display
Safety Data Sheets
No safety data sheets to display
Soldering Materials for SiP and IoT Blog Posts
No-Clean Fluxes in Semiconductor Assembly
This video is for electronics manufacturers who are interested in cleaning techniques for Internet of Things (IoT) devices. It will cover water-soluble and no-clean materials and processes...
SiP Materials (System-in-Package) VIDEO
Let's explore the SiP process, especially the solder paste printing process...
Indium3.2HF Solder Paste for SIP Assembly
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller...
For comments or questions about the content on this page, please contact:
Sze Pei Lim
Semiconductor Product Manager - Southeast Asia
splim@indium.com
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2017. All Rights Reserved. | Site Map | Privacy Policies
Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.
Connect with Indium.
Read our latest posts!