Soldering Materials for HIA and SiP
Indium Corporation’s soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications have a PROVEN track record with more than 2 billion SiP front-end module (FEM) SiP devices manufactured in the last 3 years using Indium Corporation materials.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA and SiP applications.
Soldering Materials for Heterogeneous Integration & Assembly (HIA)
3D Logic / Memory and Flip-Chip
Wafer Bumping (Bump Fusion) Fluxes
- Water-soluble
- Spin-on and jetting
- Halogen-free
Flip-Chip Flux
- Water-soluble, ultra-low residue, and standard no-clean
- Dipping, spraying, and jetting
- Halogen-free and halogenated
System-in-Package
Wafer Level Ball-Attach Flux
- Water-soluble
- Halogen-free
Ultrafine-Pitch Solder Paste
- Water-soluble, ultra-low residue, and standard no-clean
- Halogen-free
- Type 6, 7
Lidded MEMS
Dispensable Fine-Pitch Solder Paste
- No-clean and ultra-low residue no-clean
- Halogen-free
- Type 4, 5, 6
Ball Grid Array
Ball-Attach Flux
- Water-soluble
- Pin transfer and printing
- Halogenated and halogen-compliant
Recommended Semiconductor Fluxes and Solder Pastes for HIA
Soldering Materials for SiP Videos
-
SiP Materials (System-in-Package)
-
SiP Materials (System-in-Package)
-
Indium3.2HF Solder Paste
-
Ball-Attach Flux: WS-575-C-RT
-
No-Clean Fluxes in Semiconductor Assembly
Related Markets and Applications
Top Soldering Materials for SiP Technical Documents
Soldering Materials for SiP Technical Documents
Whitepapers
No whitepapers to display
Presentations
No presentations to display
Application Notes
No application notes to display
Product Data Sheets
No product data sheets to display
Safety Data Sheets
No safety data sheets to display
Soldering Materials for SiP Blog Posts
SiP Materials (System-in-Package) VIDEO
Let's explore the SiP process, especially the solder paste printing process...
Indium3.2HF Solder Paste for SIP Assembly
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller...
For comments or questions about the content on this page, please contact:
Sze Pei Lim
Regional Product Manager - Semiconductor
splim@indium.com
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2018. All Rights Reserved. | Site Map | Privacy Policies
Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.
Connect with Indium.
Read our latest posts!
Privacy Policy