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Soldering Materials for SiP

Home » Applications » Soldering Materials for SiP

  • Soldering Materials for SiP
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Soldering Materials for SiP

Indium Corporation’s soldering materials for system-in-package (SiP) applications have a PROVEN track record with more than 1 billion SiP front-end module (FEM) SiP devices manufactured in the last 2 years using Indium Corporation materials.

From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP applications.

SiP Illustration

SiP Solder Pastes

  • Applied usually by printing or jetting
  • Reflow in inert atmosphere (typically
    < 100ppm O2 level)
  • Compatible with SnAgCu, SnAg, SnSb, or other common Pb-free alloys

Wafer-Level or Panel-Level Package Fluxes

  • Applied by printing onto wafer or panel using screen or stencil, followed by ball drop process
  • Reflow in inert atmosphere (typically
    < 100ppm O2 level)
  • Compatible with wide variety of passivation material

Ball-Attach Fluxes

  • Applied by pin transfer or printing
  • Reflow in air, but also suitable for use in reduced-oxygen atmosphere (typically
    < 500ppm O2 level)

Flip-Chip Fluxes

  • Applied by dipping or spraying
  • Reflow in inert atmosphere (typically
    < 50ppm O2 level)
  • Designed to be used in specific applications, from standard, large pitch solder bumps onto ENIG surfaces, to ultrafine pitch microbumps onto copper OSP, mass reflow, and TCB process
  • Ultra-low residue no-clean fluxes with controlled solderability and compatible with wide variety of underfill materials

Wafer-Bumping Fluxes

  • Applied by jetting or dispense, followed by spin coating to optimize film thickness
  • Reflow in inert atmosphere (typically
    < 20ppm O2 level)
  • Converts rough, non-spherical, plated or wafer probe-dented solder bumps into shiny hemispheres
  • Proven applications include both copper-pillar microbumps and standard bumps
SiP Chart

Soldering Materials for SiP Videos

  • SiP Materials (System-in-Package)

    SiP Materials (System-in-Package)

  • SiP Materials (System-in-Package)

    SiP Materials (System-in-Package)

  • Indium3.2HF Solder Paste

    Indium3.2HF Solder Paste

  • Ball-Attach Flux: WS-575-C-RT

    Ball-Attach Flux: WS-575-C-RT

  • No-Clean Fluxes in Semiconductor Assembly

    No-Clean Fluxes in Semiconductor Assembly

Related Markets and Applications

  • MEMS Lid-Attach Solder Paste

Top Soldering Materials for SiP Technical Documents

Soldering Materials for SiP Technical Documents

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Soldering Materials for SiP Blog Posts

SiP Materials (System-in-Package) VIDEO

14 Sept 2016 by Indium Corporation® [view bio]

Let's explore the SiP process, especially the solder paste printing process...

Read More

Indium3.2HF Solder Paste for SIP Assembly

10 Apr 2017 by Indium Corporation® [view bio]

SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller...

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Sze Pei Lim
Semiconductor Product Manager - Southeast Asia
splim@indium.com

From One Engineer to Another®

All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.

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