Soldering Materials for SiP
Indium Corporation’s soldering materials for system-in-package (SiP) applications have a PROVEN track record with more than 1 billion SiP front-end module (FEM) SiP devices manufactured in the last 2 years using Indium Corporation materials.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP applications.
SiP Solder Pastes
- Applied usually by printing or jetting
- Reflow in inert atmosphere (typically
< 100ppm O2 level) - Compatible with SnAgCu, SnAg, SnSb, or other common Pb-free alloys
Wafer-Level or Panel-Level Package Fluxes
- Applied by printing onto wafer or panel using screen or stencil, followed by ball drop process
- Reflow in inert atmosphere (typically
< 100ppm O2 level) - Compatible with wide variety of passivation material
Ball-Attach Fluxes
- Applied by pin transfer or printing
- Reflow in air, but also suitable for use in reduced-oxygen atmosphere (typically
< 500ppm O2 level)
Flip-Chip Fluxes
- Applied by dipping or spraying
- Reflow in inert atmosphere (typically
< 50ppm O2 level) - Designed to be used in specific applications, from standard, large pitch solder bumps onto ENIG surfaces, to ultrafine pitch microbumps onto copper OSP, mass reflow, and TCB process
- Ultra-low residue no-clean fluxes with controlled solderability and compatible with wide variety of underfill materials
Wafer-Bumping Fluxes
- Applied by jetting or dispense, followed by spin coating to optimize film thickness
- Reflow in inert atmosphere (typically
< 20ppm O2 level) - Converts rough, non-spherical, plated or wafer probe-dented solder bumps into shiny hemispheres
- Proven applications include both copper-pillar microbumps and standard bumps
Soldering Materials for SiP Videos
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SiP Materials (System-in-Package)
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SiP Materials (System-in-Package)
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Indium3.2HF Solder Paste
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Ball-Attach Flux: WS-575-C-RT
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No-Clean Fluxes in Semiconductor Assembly
Related Markets and Applications
Top Soldering Materials for SiP Technical Documents
Soldering Materials for SiP Technical Documents
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Soldering Materials for SiP Blog Posts
SiP Materials (System-in-Package) VIDEO
Let's explore the SiP process, especially the solder paste printing process...
Indium3.2HF Solder Paste for SIP Assembly
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller...
For comments or questions about the content on this page, please contact:
Sze Pei Lim
Semiconductor Product Manager - Southeast Asia
splim@indium.com
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All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
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