Biographies - Thermal Interface Materials. Developments In Thermal Market and Thermal Advancements

Amanda M. Hartnett

Amanda is an Applications Engineer supporting Indium Corporation's Thermal Interface Products. She is experienced in addressing thermal design issues in many different industries, including communications, military, and photonics. Amanda specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials, and other bonding materials, to achieve reliable and high-performance thermal attachment solutions.

Amanda has presented at industry technical seminars such as IMAPS (International Microelectronics and Packaging Society: Thermal Management). She has authored technical papers on thermal management and microelectronics packaging materials. Amanda is active in several industry organizations including SPIE, IMAPS, and the IPC.

Prior to establishing her career with Indium Corporation, Amanda received her BS in Chemistry from Utica College and worked as a research lab technician at Cornell University, focusing on the physical properties of silicon. She is a member of the American Chemical Society.