Thermal K Values List
Denotes Materials that Indium Corporation can provide
Indalloy
Number |
Material |
Thermal Conductivity
W/(m - K) |
Remarks |
| |
Diamond |
1300-2400 |
|
| |
Silver |
429 |
|
| 200 |
100Au |
318 |
|
| |
Al |
240 |
|
| 4 |
100In |
86 |
|
| 290 |
97In3Ag |
73 |
|
| 128 |
100Sn |
73 |
|
| 3 |
90In10Ag |
67 |
|
| 201 |
91Sn9Zn |
61 |
|
| 182 |
80Au20Sn |
57 |
|
| 227 |
77.2Sn20In2.8Ag |
54 |
|
| 106 |
63SnPb37 |
50 |
|
| 9 |
70Sn18Pb12In |
45 |
|
| 2 |
80In15Pb5Ag |
43 |
|
| 204 |
70In30Pb |
41 |
|
| 1E |
52In48Sn |
34 |
|
| 1 |
50In50Sn |
34 |
|
| 121 |
96.5Sn3.5Ag |
33 |
|
| 205 |
60In40Pb |
29 |
|
| 205 |
60In40Pb |
29 |
|
| 133 |
95Sn5Sb |
27 |
|
| 281 |
58Bi42Sn |
19 |
|
| 19 |
51In32.5Bi16.5Sn |
|
|
| 51 |
62.5Ga21.5In16Sn |
40 |
|
| |
Phase Change Materials |
3 - 8 |
|
| |
Thermal Grease |
.75 - 6 |
|
| |
Ag - Filled Die Attach |
1.3 - 5 |
|
| |
Molding Compounds |
0.6 - 0.7 |
|
| |
BT Epoxy |
0.19 |
|
| |
FR - 4 |
0.11 |
|
