Solder TIM (sTIM)
Introduction
Indium Corporation’s Solder Thermal Interface Materials Radically Improve:
- Heat dissipation efficiency in electronic devices
- Thermal conductance for high power devices – with densities in excess of 1000 watts
- End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
- Portable device battery performance – by reducing thermal resistance and cooling fan size
- Portable device use profile – by reducing heatsink size and mass
- Compliance with RoHS while accommodating step soldering requirements
Indium Corporation has solutions for:
- Telecom
- Medical
- Computing
- Cryogenics
- Semiconductors
- Automotives
- LEDs
- Power Devices
- Photonics
Confidentiality
Indium Corporation recognizes the Importance of confidentiality in the design of thermal interface solutions. As a trusted partner, our engineers
will work with you to help you find the right solution for your thermal interface problems. We can help you find the right alloy for performance
and the best solder form for ease of assembly.
Applications
Some non-confidential applications include:
- Semiconductor Integrated Circuits
- Power QFNs
- Power device to PCB attach (TO220, etc.)
- Telecom
- Die Attach (Photonics, MOSFETS, etc.)
- LED attach
Products
- AuSn solder
- InPb solders
- Pure Indium
- Informs
- SnPb solders
- SAC Pb-Free solders
The Indium Advantage
We are committed to understand your unique needs for materials in your product and for your process. No company offers a wider selection of alloys
and solder forms to meet your needs. Our variety of alloys, ability to fabricate and package these alloys into easy-to-use forms, and our decades
of application knowledge are the core values we bring to your company. Tap into this knowledge-base by calling one of our certified engineers at
1-800-4-INDIUM or visit www.indium.com.
