Compressible TIM (SMA-TIM) Heat-Spring®

Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. We developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.

BLT Thermal Resistance of Representative Materials	Gap Thermal Resistance (w/o Reflow)	Bulk Thermal Resistance
View Full Size Chart	View Full Size Chart	View Full Size Chart

An SMA-TIM made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our patent pending heat-spring® technology will further reduce the thermal resistance.

Indium's line of high-end thermal interface materials delivers superior performance over time. As SMA-TIM products are made of metal, they cannot experience pump out problems even under power cycling. The heat-spring® material, which does not contain silicone, will conform to surface disparities over time, thereby reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also resists bake out.

Confidential - Password Protected

• TTV Profile Comparison Bake 1500hrs
• Thermal Resistance (ASTM D5470)
• Curves at High Pressure vs. Grease
• HSD 1E and 4
• ind1e and ind4 hsd
• Indium High Pressure vs. Grease