Indium Corporation Homepage
TIM Homepage
Non-Reflow TIMs
Liquid Metal
Compressible TIM (SMA-TIM) Heat-Spring
®
Burn-in Thermal Interface Materials
Reflow TIMs
InFORMS
®
Solder Preforms
Indium Solder
NanoFoil
®
Flux Coated Preforms
TIM Fluxes
Not Sure? Find your best solution
Metal Alloy Reference Information
Alloy Sorted by Temperature
Alloy Sorted By Indalloy Number
Pb-Cd Free
Thermal K Values List
Information
Product Data Sheets
Application Notes
Articles
Request A Quote
Contact Information
INDIUM CORPORATION
ATTN: Mr. Jordan Ross
34 Robinson Road,
Clinton NY 13323 USA
+1.315.853.4900 x7591
TIM@indium.com
Home
Bloggers
Table of Specialty Solders & Alloys
Chinese Language Site
Online Knowledgebase
Indium Corporation News
Products
Bismuth-based Products
Circuit Board Assembly Products
Engineered Solders
Fusible Alloys
Gold Alloy Assembly Materials
Halogen-Free Soldering Materials
Indium Compounds
Indium Metal
Indium Wire
Low-melting Solders
Medical Assembly Products
NanoFoil® and NanoBond®
Pb-Free Soldering Materials
Physical Properties Table
Reclaim & Recycle
Research Kits
Semiconductor Packaging & Assembly Materials
Solar (Photovoltaic) Assembly Products
Solder Fabrications
Solder Fortification™
Soldering for Medical Devices and Electronics
Sputtering Materials
Thermal Interface Materials
Wave Solder Assembly Materials
Services
Customer Services
Sales Support
Technical Support
Technical Documents
Corporate
About Us
Contact/Shipping Info
Biographies
Job Opportunities
Community Support
Awards
Trade Shows
Indium Corporation News
E-commerce
Bar Solder
Solder Flux
Solder Paste
Solder Ribbon/Foil
Solder Wire
Indium Chemicals
Indium Metal
NanoFoil
Solar Tabbing Products
Solder Fortification™
Solder Research Kits
Thermal Interface Materials
Technical Documents
Material Safety Data Sheets
Product Data Sheets
Application Notes
Technical Papers
Non Metallic Bonding
Contact Us
Request a Quote
Download RFQ Form
If you prefer:
give us a call: +1.315.853.4900
email us:
TIM@indium.com
Company Name:
Contact Name:
Contact Number:
Contact Email:
Contact Fax Number:
Customer Billing Address:
Customer Shipping Address:
Special Shipping Requirements:
Shape: Select one
Square
Disk
Rectangle
Frame
Special Shape
Liquid
Paste
Dimensions
x
x
Tolerances +/-
Thickness
Quantity
Tolerances +/-
Do you have a print?
Yes
No
Print Number:
Do you have a specification?
Yes
No
Specification Number:
Customer part number?
Yes
No
Part Number:
Preferred Pack:
Loose
Waffle
Stack Pk.
Layer Pk.
Tape & Reel
Bottle
Jar/Syringe
Is this process for?
Reflow
Non-Reflow (compression)
Pressure
For reflow, what is your metalization (Die & Lid/Heat Sink):
Do you require a flux coating?
Yes
No
Is your process lead free?
No
Yes
Do you require Halide Free?
No
Yes
Is there any Aluminum in your solution?
Yes
No
What is your desired Bond Line Thickness?
What is the size of your heat source?
What is your power in watts?
max temp?
What is the Planarity of the interface um or mils per inch (25.4mm)
What is the material of your Heat-Spreader if applicable?
If Copper on your spreader, is it plated?
Yes
No
If so, what kind?
If you have identified a thermal problem you need to solve, can you describe it here. Thank you.
Share This
Email a Friend
Share on Facebook
Share on LinkedIn
Tweet this
Digg this
Add to del.icio.us
More