Indium Corporation
Thermal Blog

Non-Reflow TIMs

Reflow TIMs

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Metal Alloy Reference Information

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Contact Information

Contact Amanda Hartnett

  • INDIUM CORPORATION
  • ATTN: Mr. Jordan Ross
  • 34 Robinson Road,
    Clinton NY 13323 USA
  • +1.315.853.4900 x7591
  • TIM@indium.com

Amanda Hartnett
Metal Thermal Interface Materials

Request a Quote
If you prefer:
give us a call: +1.315.853.4900
email us: TIM@indium.com
Company Name:
Contact Name:
 Contact Number:
Contact Email:
 Contact Fax Number:
Customer Billing Address:
 Customer Shipping Address:
Special Shipping Requirements:
Shape: Select one
Square Disk Rectangle Frame Special Shape Liquid Paste
Dimensions x x Tolerances +/-
Thickness Quantity Tolerances +/-
Do you have a print? Yes No Print Number:
Do you have a specification? Yes No Specification Number:
Customer part number? Yes No Part Number:
Preferred Pack:
Loose Waffle Stack Pk. Layer Pk. Tape & Reel Bottle Jar/Syringe
Is this process for?
Reflow Non-Reflow (compression) 		Pressure
For reflow, what is your metalization (Die & Lid/Heat Sink):
Do you require a flux coating? Yes No    
Is your process lead free? No Yes
Do you require Halide Free? No Yes
Is there any Aluminum in your solution? Yes No
What is your desired Bond Line Thickness?
What is the size of your heat source?
What is your power in watts? max temp?
What is the Planarity of the interface um or mils per inch (25.4mm)
What is the material of your Heat-Spreader if applicable?
If Copper on your spreader, is it plated? Yes No
If so, what kind?
If you have identified a thermal problem you need to solve, can you describe it here. Thank you.
 
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