Hi,

Is there any update on the packing material – includes the anti-staic covers, packing box etc.

Should these be RoHS Compliant?

Regards.
Kiran
Component Engineering
Tejas Networks

]]>

DEAR SIR,
GOOD DAY. I SHALL BE MUCH OBLIGED IF YOU WILL SEND ME A COPY OF EXCEL SPREAD SHEET AT YOUR EARLIEST CONVENIENCE. I THANK YOU FOR YOUR SERVICE BY PROVIDING SIMPLE METHOD TO CALCULATE ALLOY DENSITY.
THANKING YOU AGAIN.
WISH YOU GOOD LUCK FOR EVERY GOOD THING YOU LOVE TO ENJOY.
KIND REGARDS,
B.R.RAVI.

]]>

I work for a company that produce High Power Amplifiers, does ROHS apply to this field? Note that are used TWT tubes.
Another series of products instead is for the EU market and has a PC with LCD monitor integrated..does this type of unit have to respect ROHS?
thanks

]]>

WHEN will this happen?

]]>

I can ad a few comments about Den Erickson quote.
“Mark Stretton I have always treated everyone I do Business with fairly “
If this is the case why don’t you pay your bills. You are not anything but a common thief.
I am talking about the Den Erickson of
VARBOGEN Pro Shoppe who will not answer his phone or emails. Anyone looking to do business with him beware.

]]>

i just come to know in our process rohs solder mixed with non-rohs solder,. can be clean the solder, or we should scrap the solder

]]>

hello to Dr Ron lasky
i and my brother are inventor ,we invent a new way for charging mobile devices specially for cell phon and we registered in our country in november 2005 ,our devices could insert into cell phon and work without any external power like electrical current or magentic, we don’t have any sponser or a investment to develope and produce our product for MOTOROLA ,Pleaase regard this mail or comment Dr
Thank you very much Dr Lasky
Mehdi beyzaee

]]>

I can ad a few comments about Den Erickson quote.
“Mark Stretton I have always treated everyone I do Business with fairly “
If this is the case why don’t you pay your bills. You are not anything but a common thief.
I am talking about the Den Erickson of
VARBOGEN Pro Shoppe who will not answer his phone or emails. Anyone looking to do business with him beware.

]]>

How to find contain of material in alloy, when we know materials specific gravity and alloys gravity as well as wieght ?
Can you help on this

]]>

We are seeing and will continue to see problems with SAC due to its modified charcteristics from the traditional SnPb. Just because everyone is using it, does not necessarily make it the best choice. I know the standards organizations recommend it, but they don’t provide much practical comparison evidence. I have seen and heard of issues such as voiding, poor wetting, and hot tearing with SAC, even though it is the new mainstream SnPb replacement. I am still skeptical, and believe there are better solutions to be found.

]]>

Sir How we can calculate density of ZrH2, LaNi5H6.7 means hydrogen content alloys ?

]]>

Dear Sir,

Thank you for the equations, but I have a question, what if after alloying they form a different phase? Will this equation still apply?

Also, could you still send me a copy of the excel spread sheet or any information you have on densities of alloys?

Thanks in advance.

Regards,
Edward

]]>

I am surprised that still is being debated. Education must be in a sorry state, indeed. IF the MC chooses randomly, then there is no advantage to switching. IF the MC does not (and selectively chooses to reveal a door that does NOT contain the prize), then simple probability reveals that there is an advantage to switching. Marilyn is obviously and totally right.

If this is not obvious to you, it is helpful to draw a simple tree enumerating all possible outcomes (a “collectively exhaustive, mutually exclusive sample set”). Then it is trivial to count up the outcomes that favor switching, and compare those to the ones that don’t. You’ll immediately see that switching confers an advantage, IF the MC has foreknowledge.

]]>

[...] museum will publish a catalogue of its Persian ceramics in June [...]

]]>

Dear Sir,
Is there a possibility to obtain a copy of the excel sheet that calculates density automatically.

Thank You in advance.

With Regards,
Ramesh

]]>

If you permute what’s behind the doors beforehand, by assumption this will not influence the player or the host. Therefore the probability that the host will pick a particular goat or car is uniform – always 1/3. Likewise the player has an equal probability of choosing the remaining two doors.

That’s probably the simplest argument.

Another argument is to use the conditional probability equation, P(A given B)=P(A and B)/P(B). In this case, let B be the event in which the host opens the door with a goat behind it. An easy mistake to make is to think this has a probability of 1, but in fact it is again 2/3. If the argument in the first paragraph isn’t convincing, think about the two cases which occur after the player picks a door:

Case 1: Player picks the door with a car. Probability that the host picks a goat: 1.

Case 2: Player picks a door with a goat. Probability that the host picks a door with a goat: 1/2.

The first case occurs with 1/3 probability and the second with 2/3 probability, so the total probability for the case in which the host picks a door with a goat is

P(player picks car)*P(host picks goat given player picks car) + P(player picks goat)*P(host picks goat given player picks goat) = 2/3.

To complete the original equation, we need P(player picks car AND host picks goat). But that should be obvious – if the player picks a car, the host necessarily has picked a goat, so it’s 1/3. And (1/3)/(2/3) = 1/2, so the probability that you picked a car GIVEN that the host picked a goat is a half as expected.

This works out even in the new scenario you outlined.

Hope this sufficiently explains things.

cxseven on gmail

]]>

i got a manhattan archery works bow, with thw trade mark and arrow. 6’ long one piece wood. and info. one it? thank you!

]]>

My grandson ask me about the accuracy and range of a Prehistoric a bow and arrow. How far did they shoot and how accurate at that range were they? At what range would they lethal?

Thank you for your time.

Paul V. Long Jr.
Archaeologist

]]>

the introduction REACH and SVHC will have a much more profound effect on packaging components than RoHS, we should be scared

]]>

If the RoHS sweep does not scare you as a company just wait for the REACH sweeps and SVHC list.

RoHS is the tip of the iceberg and paved the way for the much larger REACH program that will cost companies billions, put at risk companies IP.

REACH is being marketed at a greener way to test for substances and the goal is to combine all substances into one massive database so that we can “Share” in the knowledge of how substances effect our environment. However as this is generated so to is the SVHC (Substances of Very High Concern) that list those substances that the EU feels is not in the best interest of the environment (or better way to state it is the list that EU can apply a substance Tariff that will allow for the continued import.) Also a good way to get information on companies IP.

So be ready to have your checkbook ready, as it is free this year to register what it is you ship into the EU and at what tonnage you ship it. You can bet there will be a yearly bill sent to you and your company for the importing of that substance.

]]>

Ron, did you overlook the $3.7 annually squandered on RoHS, bringing the current total to $38 Billion?

Details are in my column in AP Semi-Monthy at www.apmag.com

regards—george

]]>

Hopefully this post works. Trying for the fifth time this time in a different browser.

This is from density = mass / volume.

First find the volume of each item.
D = M / V
10.5 = .04 / V
V silver = .0038095

D = M / V
7.31 = .96 / V
V tin = .13133

Now find the combined density
D= M / V
D= M1+M2 / V1+V2
D= .04+.96 / .0038095+.13133
D= 7.399

When you have 2 components, the combined density will be between the individual components density. You can use as many components as you like. You can use whatever units for measurement you like, but they all have to match.

]]>

Crikey, i just found this site and comments. I must say all i would like is to see Mr Erickson pull that bow of his, stick a vid on you tube for us all to see. Regards.

]]>

Doc, where’d you get the bow?

]]>

Dear Doc,

We use (WET WEIGHT/DRY WEIGHT x 2307.454)-2088.136 TO CALCULATE THE DENSITY OF SMELTED RAW GOLD. COULD YOU PLEASE EXPLAIN HOW THIS WAS ARRIVED AT.

GUYANA GOLD BOARD
GUYANA, SOUTH AMERICA.

]]>

kevin, the french did not adapt to using the longbow because they were afraid of a revolt if they placed such power in the lower class hands.

HEY,guys, i just was looking up some research on the longbow for a school project, i have to make one in 3 days, i was wondering if anyone has any tips? i have never shot a bow before, but i always wanted to. my friend is coming over to help me out, so please e-mail me at sywalker456@yahoo.com if you have any tips for me. THANKS! -New Longbowman]]>

Den Erickson’s “e-commerce” website is simply the free version offered by tripod.com — and that’s not too professional for someone who claims to be so awesome and accomplished in the archery world. Caveat emptor — Buyer beware! Or in this case Archer beware. :)

]]>

Dear Dr. Lasky,
Can you also give me the Excel spreadsheet of the calculating the density

Thank you Tommy Fan ]]>

Dear Dr. Lasky;

I saw your requirement on informations about Cr VI issues during a survay I was working… If you are still interested on such matter, please let me know and I can give you indications about informations on SurTec website as well as contact to a fellow in US that can give you more detailed info about that!

Regards

Carlos Chaves

]]>

Hi Ron!

What an adorable dog! Has your snow melted yet? Our snow in Shrewsbury MA is gone and we are eagerly anticipating a 65 degree day tomorrow! I hope all is going well. Drop me a line when you can.

Regards,

Lisa Cassinari
Millstream Associates
HR Consultant/Recruiter
www.millstreamassociates.com

]]>

dear sir

please i want to buy the niton

to i so need in my work

i want to know the price for this niton

my phone :

0101215477

]]>

Please send me the density of

ZrFe2 alloys

thank you

]]>

Hi, Dr. Lasky,

I found in this article, it mensioned that this new copper connection is hard to repair or disassemble.

How about traditional Solder? As far as I know, if we find solder joint failed, we also have to take the package away, then sputter the solder paste, which is also messy. Is there any better way to repair solder make it easier than this copper connections?
Thanks,
Xi

]]>

Thank you for this method of calculating the density of an alloy, but what about if there is intermetallics or vacancies.

]]>

Hello Dr.Lasky,
Now we are trying to set up a PCB assembly cost estimating model, we only get the PCBA and we generate the BOM from it.
Would you pls help to send us some class notes on it?

Thanks you.

Tari

]]>

Please send me a copy of the spreadsheet for the density calculator. We manufacture fine diameter wire using precious metals and this will be a great help with alloys that are not standard. Thanks.

]]>

There is a golf course down here in Salem, NH that is scheduled to open March 28th. Come on down!

]]>

As for mr. Erickson…........I can tell you a few things that you must know.

He was a hero. And I have seen first hand that he can acheive all he has claimed. I challenge any of you to a dual with him…..he will be the world strongest archer

]]>

I have been searching for info on the radiation safety aspects of handheld XRF devices and unfortunately manufacturers/distributors do not seem to include much on this issue. What are your thougts? I have come across a few devices that can give significant dose rates close to the device and even several metres away from them.Also there seems to be quite a high X-ray leakage from them.
The engineering controls (interlocks etc) are non-existent and most emphasis is placed on procedural controls which is alarming to say the least as any tom dick or harry can pick one up and point it at anything or anyone with little control.

]]>

I agree that for Roger Clemens’ data, there does not appear to be much, if any, evidence (based on the R**2 value) that Age has any kind of predictive qualities for Roger. That said, the NYT graph shows a strong curve for the “typical” pitcher…Roger Clemens showing no relationship may then be sufficient enough evidence that he differs from typical pitchers (possibly from artificial means).

]]>

I always prefer to buy toys & games for my kids at most discounted prices from Little Tikes store…..!

]]>

I have been searching for a mat’l density spread sheet so I can incorperate it into a spread sheet for costing Steel production processes. I sure home this is the one.

Ryan

]]>

Can anyone tell me about the reverse reaction? Does grey alpha tin revert to white beta tin at temperatures above 13.2C?

]]>

@ David:

I am Rick Short, Indium Corporation’s Director of Marketing Communications. More at www.indium.com/rickshort/bio.

David, thank you for your comment to Dr. Lasky’s posting. Fellow technologists like you are what make this industry so fun and interesting. You help us, you keep us on our toes, and we all grow together.

Indium is a technology-based company that builds virtually everything we do on scientific reasoning and logic – at least we try to. Dr. Lasky’s blog is a testament to that. As he has written on his sideblog, ...“I am pro data driven decision making”.

Therefore, Indium Corporation doesn’t “worry about” technological developments in materials or processes. Instead, Indium strives to focus on developing, and keeping abreast of other’s developments, in these areas.

We know change is inevitable and desired. We aim to be that (positive) change, as best we can.

Dr. Lasky’s statement regarding being a data-driven decision maker has at least two critical elements:

1) data and data-driven: we strive to either create or accumulate, then analyze good data.

2) decision making: with this data, and our analyses, we strive to use good decision making to chart our course.

This is certainly not unique to Indium Corporation, but it is part of our corporate core.

So, we are not worried about new technological developments. Such events are what has allowed our company to grow and thrive for the past 74 years. We embrace change and growth. Occasionally we get caught out, or a competitor outdoes us, or we fail to identify a technological trend in time. Occasionally we come out on top. Either way it is the constant stress and pressure, the test, and the competition that combines with our innate technological curiosity to make us better.

I have been in this industry for 24 years and I can confidently say that virtually all of Indium’s global competition could have written the same comments. This is a good industry – full of curious, capable, and smart people.

Whatever happens – it will benefit us all.

Thanks, David. Keep the good stuff coming.

]]>

Dear Dr. Ron,

I accidently posted this on your earlier blog and am not sure if you read the earlier reponses so I am sending it again here.

I thought you would find the article below of interest. Is appears that now there is more that just Occam to worry about. It looks like Georgia Tech is now promoting solder free assembly also. Do you think that solder on its way out?

Thanks,
David

Copper Pillars Poised to Replace Solders
Wednesday, February 13, 2008|Georgia Institute of Technology

As computers become more complex, the demand increases for more connections between computer chips and external circuitry such as a motherboard or wireless card. And as the integrated circuits become more advanced, maximizing their performance requires better connections that operate at higher frequencies with less loss.
Improving these two types of connections will increase the amount and speed of information that can be sent throughout a computer, according to Paul Kohl, Thomas L. Gossage chair and Regents’ professor in Georgia Tech’s School of Chemical and Biomolecular Engineering. Kohl presented his work in these areas at the Materials Research Society fall meeting.

The vertical connections between chips and boards are currently formed by melting tin solder between the two pieces and adding glue to hold everything together. Kohl’s research shows that replacing the solder ball connections with copper pillars creates stronger connections and the ability to create more connections.

“Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also,” said Kohl.

Solder and copper can both tolerate misalignment between two pieces being connected, according to Kohl, but copper is more conductive and creates a stronger bond.

With funding from the Semiconductor Research Corporation (SRC), Kohl and graduate student Tyler Osborn have developed a novel fabrication method to create all-copper connections between computer chips and external circuitry.

The researchers first electroplate a bump of copper onto the surface of both pieces, a process that uses electrical current to coat an electrically conductive object with metal. Then, a solid copper connection between the two bumps is formed by electroless plating, which involves several simultaneous reactions that occur in an aqueous solution without the use of external electrical current.

Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. All-copper connections between computer chips and external circuitry will lead to increased computing speeds. (Image courtesy of Tyler Osborn)

Since the pillar, which is the same thickness as a dollar bill, is fragile at room temperature, the researchers anneal it, or heat it in an oven for an hour to remove defects and generate a strong solid copper piece. Osborn found that strong bonds were formed at an annealing temperature of 180 degrees Celsius. He has also been investigating how misalignments between the two copper bumps affect pillar strength.

“I’ve also studied the optimal shape for the connections so that they’re flexible and mechanically reliable, yet still have good electrical properties so that we can transmit these high frequency signals without noise,” said Osborn.

The researchers have been working with Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl, director of Georgia Tech’s Microelectronics Research Center and professor in the School of Electrical and Computer Engineering, and Sue Ann Allen, professor in the School of Chemical and Biomolecular Engineering, have also collaborated on the work.

In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing an improved signal transmission line with the help of graduate student Todd Spencer.

“Several very long communication pathways exist inside a computer that require a very high performance electrical line that can transmit at higher frequencies over long distances,” explained Spencer.

This is especially important in high-performance servers and routers where inter-chip distances can be large and signal strength may be significantly degraded. Kohl and Spencer have developed a new way to link high-speed signals between chips using an organic substrate, with funding from the Interconnect Focus Center, one of the Semiconductor Research Corporation/Defense Advanced Research Projects Agency (DARPA) Focus Center Research Programs.

Fabrication begins with an epoxy fiberglass substrate with copper lines on one side. The substrate is coated with a polymer and the areas without copper lines are exposed to ultraviolet (UV) light, which disintegrates the polymer where it’s not wanted. Then, the researchers coat the substrate with another polymer that hardens when exposed to UV light. Layers of titanium and copper are added on top of each copper line. When the layered substrate is heated at 180 degrees Celsius, the first polymer layer decomposes into carbon dioxide and acetone, which diffuse out leaving an air pocket.

“The amount of electrical loss relates to the connection’s sensitivity at higher frequencies,” explained Spencer. “Just having this air pocket there reduces our signal loss greatly.”

The researchers are currently designing a coaxial cable for this chip-to-chip signal link, which should greatly increase the maximum signal frequency the connection can carry.

Companies that make computer chips and package them into a device are very interested in these technologies, said Kohl.

“If these connections can be produced at a reasonable cost, they could be very important in the future because you’re giving the customer a better product for the same cost,” said Kohl.

]]>

Dr. Ron,

I enjoy reading your blog.

I thought you would find the article below of interest. Is appears that now there is more that just Occam to worry about. It looks like Georgia Tech is now promoting solder free assembly also. Do you think that solder on its way out?

Thanks,
David

Copper Pillars Poised to Replace Solders
Wednesday, February 13, 2008|Georgia Institute of Technology

As computers become more complex, the demand increases for more connections between computer chips and external circuitry such as a motherboard or wireless card. And as the integrated circuits become more advanced, maximizing their performance requires better connections that operate at higher frequencies with less loss.

Improving these two types of connections will increase the amount and speed of information that can be sent throughout a computer, according to Paul Kohl, Thomas L. Gossage chair and Regents’ professor in Georgia Tech’s School of Chemical and Biomolecular Engineering. Kohl presented his work in these areas at the Materials Research Society fall meeting.

The vertical connections between chips and boards are currently formed by melting tin solder between the two pieces and adding glue to hold everything together. Kohl’s research shows that replacing the solder ball connections with copper pillars creates stronger connections and the ability to create more connections.

“Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also,” said Kohl.

Solder and copper can both tolerate misalignment between two pieces being connected, according to Kohl, but copper is more conductive and creates a stronger bond.

With funding from the Semiconductor Research Corporation (SRC), Kohl and graduate student Tyler Osborn have developed a novel fabrication method to create all-copper connections between computer chips and external circuitry.

The researchers first electroplate a bump of copper onto the surface of both pieces, a process that uses electrical current to coat an electrically conductive object with metal. Then, a solid copper connection between the two bumps is formed by electroless plating, which involves several simultaneous reactions that occur in an aqueous solution without the use of external electrical current.

Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. All-copper connections between computer chips and external circuitry will lead to increased computing speeds. (Image courtesy of Tyler Osborn)

Since the pillar, which is the same thickness as a dollar bill, is fragile at room temperature, the researchers anneal it, or heat it in an oven for an hour to remove defects and generate a strong solid copper piece. Osborn found that strong bonds were formed at an annealing temperature of 180 degrees Celsius. He has also been investigating how misalignments between the two copper bumps affect pillar strength.

“I’ve also studied the optimal shape for the connections so that they’re flexible and mechanically reliable, yet still have good electrical properties so that we can transmit these high frequency signals without noise,” said Osborn.

The researchers have been working with Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl, director of Georgia Tech’s Microelectronics Research Center and professor in the School of Electrical and Computer Engineering, and Sue Ann Allen, professor in the School of Chemical and Biomolecular Engineering, have also collaborated on the work.

In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing an improved signal transmission line with the help of graduate student Todd Spencer.

“Several very long communication pathways exist inside a computer that require a very high performance electrical line that can transmit at higher frequencies over long distances,” explained Spencer.

This is especially important in high-performance servers and routers where inter-chip distances can be large and signal strength may be significantly degraded. Kohl and Spencer have developed a new way to link high-speed signals between chips using an organic substrate, with funding from the Interconnect Focus Center, one of the Semiconductor Research Corporation/Defense Advanced Research Projects Agency (DARPA) Focus Center Research Programs.

Fabrication begins with an epoxy fiberglass substrate with copper lines on one side. The substrate is coated with a polymer and the areas without copper lines are exposed to ultraviolet (UV) light, which disintegrates the polymer where it’s not wanted. Then, the researchers coat the substrate with another polymer that hardens when exposed to UV light. Layers of titanium and copper are added on top of each copper line. When the layered substrate is heated at 180 degrees Celsius, the first polymer layer decomposes into carbon dioxide and acetone, which diffuse out leaving an air pocket.

“The amount of electrical loss relates to the connection’s sensitivity at higher frequencies,” explained Spencer. “Just having this air pocket there reduces our signal loss greatly.”

The researchers are currently designing a coaxial cable for this chip-to-chip signal link, which should greatly increase the maximum signal frequency the connection can carry.

Companies that make computer chips and package them into a device are very interested in these technologies, said Kohl.

“If these connections can be produced at a reasonable cost, they could be very important in the future because you’re giving the customer a better product for the same cost,” said Kohl.

]]>

Sir,

Thank you for the information. Kindly send the excel file.

Thanks a lot

]]>

Dear Sir,

Our company has the availability of 5 tons/month of Tin Rohs (94%-Tin, 3%-Copper, 3%-Silver). Can you refer me to a party who might be interested in the procurement of this material.

Sincerely, Ami 917-294-8801 Cell]]>

Hi, I am very interested in the WEEE software.

Please contact me.

Thanks

David Baker

]]>

Hi, I am very interested in the WEEE software.

Please contact me.

Thanks

David Baker

]]>

Thank you Tim & Dr.Ron.
It’s very useful info. We do expect more.

]]>

Richard,

Get a bow scale. They go up to 90 pounds and you can pull at several distances and plot a graph. Surprisingly the bows are very linear.

I think Jay St Charles at Pacific Yew Classics could make you a 100 to 130 poind bow at 32-34 inch draw.

Find him with Google.

Best,

DR

]]>

The bow in the above looks like a piece of balsa wood. There is no grain in the bow.

]]>

After our last conversation, this is how it stands:Den is 33 years of age, bachelors degree in business, 13 years in the military, 6th degree black belt. You do the math. At least 24 years old for BA, plus 13 years military. that alone would make him 35 years of age. How do you fit in the 8-10 years it takes for the 6th degree black belt. This guy is a FRAUD,LIAR and is starving for attention. I was a member of the Howard Hill Longbowmens and droped out because of this JERK.

]]>

Good idea! could you send me the excel spreadsheet.Thanks.

]]>

More strict regulations on material recycle benefit all rich and poor countries, especially the poor ones.
But most of people and companies in export countries do not realize that exported electronics will end up back to our place one day. People here need more education.

]]>

I have communicated with this clown and have found him ( den ) to be full of crap. This photo depicts a fat out of shape person, not muscular. He has told me of his martial arts training, yet his knuckles look like mine before my training. They now look like small golf balls. I have a degree in metalurgy, yet Den seems to know more about the properties of steel than me? At 33 years of age, he seems to have accomplished what would take a lifetime for anyone else. Lets see, 12 years through high school, 4 years of college, 4 years in the military, powerlifting and at least 7 years to reach his 6th Dan in martial arts. WOW!!!!!!!

]]>

Am going to work my way up to beat your record (have a few years left to achieve it by 60) but have difficulty in getting an accurate measurement of wight pulled. As most bows are measured at shorter distances than I pull (being 6’ 9” ish) I tend to over pull the bow.

Any advice on measuring?

]]>

Dear Dr Ron,
i m interested to calculate density of intermetallic coumpound Fe2CrAl. Can i used same method for this coumpound?

]]>

Just want to clarify that our Web site has not taken one dime from Joe or from Verdant Electronics. Also, the column you’re referring to was not an endorsement of Occam—only of Joe.

As for the build-up on our site, I’d refer you to Ray Rasmussen. He is a big believer in Occam, and his columns reflected his opinion—not our Web site’s.

Ken, I’d be glad to discuss this with you further (530-852-7076).

Thanks for your blog, Ron.

Steve

]]>

I recalled some of our talking on the archery. That was so interesting. Do you have any information about women’s archery? Are there many women doing this?

]]>

Archery is a sport of skill,learning to focus ones own abilits,I Love archeryi shoot a #50 english Longbow made by chris stanley,unfortunaly he does not make bows anymore,such a nice bow to shoot with medival style arrows with bodkins at a range of 230 to about 250 sometimes more,they weigh about 560 grains,I guess my questin is I want the 300 to 500 range plus,how can i acheive this with the woods i have and the bow i use,been experimenting but would like more input on this situationat hand,thank you Terry J Ceres Ca

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I have to agree with Jubblet. As an archer myself I thought I would have an interesting read here about longbow/warbow draw weights and ranges. Instead I get to read a running fight between some whining babies who can’t keep their own problem out of other peoples websites. Grow up you clowns. You tarnish my sport with your garbage.

]]>

I can’t believe you ‘tards would mess up this blog like that. Can’t idiots stay out of anything these days?

]]>

Well, it’s been over a year. Any new developments with this?

]]>

Dear sir

thanks for this formular.However, could you send all formation about density for me please.

thanks.

]]>

This also has implications for hobbyists – using lead free solder is often out of the question for us, and also many hobbyists (such as myself) often recycle old electronics for parts.

Soon, we will be unable to do this as the lead free solder will be difficult to remove while leaving the parts intact – which means more waste!

What I find most irritating is that the building industry is still allowed to use lead flashing on roofing – which is directly eroded by rain and ends up in the soil and water system – far more polluting than waste electronics!

]]>

In the question the host does know what is behind the doors. He knows he is opening a door with a goat behind it. It is not a suprise. Switching would give the contestant a better chance of winning.

]]>

Not sure about official record for weight, but Kevin of Elite archery, former shooter for Bowtech, currently hold the official arrow speed record and distance (Unlimited), pulling bows up to 225 pounds. He still shoots them at current events here in the U.S. and has shot the 225 bow 70 times at one FITA event. Though I know it’s compound, it might just be something to think about.

]]>

Ron,

I don’t think the bet is a good one because the probability that there are at least two persons were born in the same day is 0.948.

It is not difficult to calculate once you know the method. Somebody reminded me that this kind of questions like the “Birthday Paradox”.

Thanks,

Anny

]]>

Ron,

I don’t think the bet is a good one because the probability that there are at least two persons were born in the same day is 0.948.

It is not difficult to calculate once you know the method. Somebody reminded me that this kind of questions like the “Birthday Paradox”.

Thanks,

Anny

]]>

Thanks for giiving us the information about density calculations. Could you send us the Excel spreadsheet.

Thanks in advance.

]]>

BTW – That should read ‘irreparable’, not ‘un-repairable’ :)

]]>

Am I the only person that thinks the legislation is focusing not on the mouse, but on a flea on the back of the mouse – not the elephant – when you consider that the major users of lead, which also happen to have the shortest shelf-life, i.e, CRTs and Car Batteries, are exempt from ROHS?

Professional equipment, which typically has a lifespan of 20+ years, is unable to use minute quantities of leaded solder, meaning that repair work will typically increase the risk of damage to the PCB due to the higher temperatures involved, yet it’s not allowed any lead content in the solder, but batteries and CRTs can go on regardless?

And we haven’t touched on the subject of tin whiskers yet…

Why is that, when you read the exemptions lists, the more political lobbying power an industry has, the more exemptions it will have?

Why have the major consumer electronics OEMs been so quiet on this issue, yet the retooling has cost them millions of dollars / Euros? Could it be because they know the legislation will put every OEM on a ‘level playing field’, whereby nothing lasts longer than 3 or 4 years?

What do the lead-free proponents have to say to Howard Johnson, Phd, who believes the ROHS legislation will create infinitely more damage to the environment than prevent? http://www.edn.com/article/CA6477864.html?nid=2431&rid=203930815

Does anyone here know their subject better than Johnson? Is he ill-informed?

The ROHS legislation is a classic example of what occurs when bureaucrats, with no qualification or experience whatsoever within the industries over which they legislate, are allowed free-reign to make laws.

I fully suppor