Dennis
]]>We ran across you website and found more interesting in packaging materials that are most company used. Thank you for the idea share. We come back often.
Thanks,
Oceans Green
EQuality Process provides inspection, counterfeit detection and environmentally controlled storage for electronic components. EQuality Process assists entities in the electronic component supply chain that focus on quality and long-term component viability. Performing to standards exceeding military and IPC/JEDEC specifications, EQuality Process will ensure that your electronic components are authentic and environmentally protected for up to 20 years.
]]>Sarah
http://grillsblog.com
]]>thanks narendra patidar
]]>Its really great stuff!!, It is nice to know that you have provided a good information to be reviewed.
Wow, this looks really fun. I am excited to surf through the link provided. The analysis of the underlying cause of defects and their individual effects on specific customer requirements, using several tools to dig deep a process would be in much ease.
Thanks,
]]>Alanna
http://www.craigslistsimplified.info
]]>http://www.youtube.com/watch?v=D1R-jKKp3NA
]]>My company manufactures fiber optics transceivers. Recently, we have received customer requests regarding lead-free capacitors, as they have heard that RoHS exemption 7c is currently being reviewed and may be annulled?
I tried searching in the internet, but I did not gather anything except some reviews about combining Exemption 5 & 7c together, and that the next exempt review on 7c will be 2011.
I’d appreciate it if you could provide me some of the insights on this.
Thanks,
Wendy
Midfielder Christian Grindheim wow gold scored from close-range, wow gold from Morten Gamst Pedersen’s cross,wow gold in the 63rd minute to give the visitors a 1-0 victory to stun the 45,000 home supporters on a wow gold freezing evening.
Not since the wotlk gold 1936 Olympics in Berlin had Germany lost to wow wotlk Norway —the defeat even more suprising as Germany coach Joachim Loew had the luxury of naming a full-strength side, wow gold while new Norway coach Egil Olsen was missing seven key players.
In Marseille, Lionel wow gold Messi scored a brilliant solo goal to give Argentina a 2-0 win over France and give Diego Maradona a second straight win as wow gold national coach.
]]>Captain Graeme Smith wow power leveling hit a fluent 75 as his side successfully passed a world of warcraft gold modest victory target of 183 on the final day at the MCG to take an wow powerleveling unassailable 2-0 lead.
It was the South African’s first-ever Test series triumph in Australia and dofus kamas victory in the third and final match in Sydney will see them leapfrog the home side at the top of the global rankings.
Hashim Amla (30 not out) scored the winning runs shortly after lunch as South Africa became the first team to overcome Australia at home since the West Indies in 1992-93.
South Africa were never under any pressure in their run chase and did not lose a wicket until just before lunch when the inspirational Smith Lord of the Rings Online Gold was trapped leg before wicket by Nathan LOTRO Gold Hauritz.
Smith had flyff penya dominated a 121-run opening stand flyff money with Neil McKenzie, hitting ffxi gil 10 boundaries.
McKenzie struggled to buy ffxi gil a half century and survived strong eq2 plat lbw shouts from Brett Lee, eq2 gold who was bowling despite an injured foot that will Lord of the Rings Online gold keep him out of the Sydney Test.
South Africa’s LOTRO gold victory was set up by a brilliant maiden Test century fly for fun penya from JP Duminy, who shared a stunning flyff penya 180-run ninth wicket partnership with pace bowler Dale Final Fantasy XI gil Steyn.
It gave the tourists ffxi gil a priceless 65-run lead on first innings before man of eq2 plat the match Steyn worked his magic with the ball as Australia were eq2 gold bowled out on the fourth day for 247 in their second innings.
The pugnacious Smith was virtually runescape money lost for words in his victory speech.
“It has been such a special moment runescape gold for all of us, it has been an incredible team effort,” he said.
“I have been smiling non-stop wow po since we hit the winning runs.
“To be 2-0 up after this game was something wow or we only dreamt of.”
South Africa won the first Test in Perth from an unlikely position, chasing 414 for victory for the loss of only four wickets.
]]>Midfielder Christian Grindheim wow gold scored from close-range, wow gold from Morten Gamst Pedersen’s cross,wow gold in the 63rd minute to give the visitors a 1-0 victory to stun the 45,000 home supporters on a wow gold freezing evening.
Not since the wotlk gold 1936 Olympics in Berlin had Germany lost to wow wotlk Norway —the defeat even more suprising as Germany coach Joachim Loew had the luxury of naming a full-strength side, wow gold while new Norway coach Egil Olsen was missing seven key players.
In Marseille, Lionel wow gold Messi scored a brilliant solo goal to give Argentina a 2-0 win over France and give Diego Maradona a second straight win as wow gold national coach.
]]>ESCS – An Industry Advocate in the Fight to Combat Counterfeits
Electronic Supply Chain Solutions, Inc. is a leading advocate in the fight to combat counterfeits in the electronic component distribution industry.
ESCS has always been actively commited to quality and to working with government and industry leaders in the development of best practices for the electronic component supply chain.
Our commitment to our customers is that nothing leaves our dock without either a proper source pedigree or a professional 3rd party test report for authenticity and/or functionality.ESCS’s credentials include:
AS9120 Certification
ESCS was among the first three companies in the U.S.A. to achieve Aerospace AS9120 certification. After five increasingly in-depth audits, the company achieved a 100% score in its 2008 full re-assessment audit.
The AS9120 standard flows down the requirements of your AS9100 manufacturer’s quality system, giving you the assurances you need that your requirements are being met with the highest quality operations, including special procedures for inventory control, split lot traceability and a stringent vendor management system.
You can easily view our AS9120 certification status and most recent audit results on the OASIS database at www.sae.org/OASIS.
CACP Founding Member ESCS is a founding member of The U.S. Chamber of Commerce’s “Coalition Against Counterfeiting & Piracy” (CACP). The CACP coordinates high level inter-governmental and industry initiatives to protect all U.S. intellectual property rights.Mr. Heaphy was an active participant in the CACP 2007 Summit in Washington, DC, representing the electronic component distribution industry.
Government & Industry Association Memberships ESCS is a member of ERAI, Inc., an industry group promoting information sharing and high standards of business ethics among independent distributors of electronic components. ESCS is also a member of The Government and Industry Data Exchange Program (GIDEP).Pioneer of Safe Source Seal Source Validation Program
ESCS’s President, Matthew Heaphy III, recognized the need for a validated means of providing sourcing declarations to aerospace and military manufacturing customers of independent electronic component distributors. As a result, the company developed the Safe Source Seal program, which was officially launched in November, 2008. Safe Source Seal has been well received by ESCS’s customers as well as industry leaders involved in developing standards for best practices to combat counterfeits. For further information, please visit www.safesourceseal.com.
Our Industry Research
With counterfeiting of electronic components rapidly escalating, there has been a lack of fact-based information available on how aerospace and military manufacturing companies have reacted to the problem. To address this information gap, ESCS staff conducted interviews with over 90 quality and procurement professionals across a range of companies, from leading prime contractors to smaller contract manufacturers. The resulting industry assessment was issued in October, 2008, “Awareness and Industry Efforts to Combat Counterfeits in Aerospace & Military Electronic Component Procurement”.
If you would like to inquire about a possible speaking engagement, please see our Contact Us page.
Free Consultative Services Mr. Heaphy and the entire staff of Electronic Supply Chain Solutions, Inc., are pleased to assist companies wishing to develop specific risk mitigation strategies to combat counterfeits. ESCS can quickly take you through a “checklist” of risk factors, look at your companies strengths and potential weaknesses and recommend appropriate steps to help secure your supply chain, while maintaining maximum flexibility to meet your program objectives.Please see our Contact Us page for information on how to reach us and begin the process.
ESCS Procurement ResourcesClick-n-Go Launchpad
This is the starting point for sourcing of electronic components, saving you time and putting at your fingertips the information you need to make sound business decisions:
Shop by commodity type
Navigate to over 3,000 manufacturers
Drill down to 100’s of RoHS initiatives
Access key entry points to the DSCC site
Look up datasheets
...and much, much more. Over 60% of buyers who visit bookmark this valuable resource.
ICPHOTOSYNTH
Photographic Parts Database
ESCS innovates with another first in the electronic component supply chain. Navigate to a high magnification photo of the part you’re looking for in a “virtual 3-D image”, with multiple parts rotated to show all part markings, logos, etc.
ICPHOTOSYNTH also gives you a link with each part photo to the related datasheet. And for future reference, ESCS keeps a photo of every lot and date code we have ever shipped to you, just an email request away.
COTSS
Component Off The Shelf Services
ESCS innovates with another first in electronic component procurement. Now you can have all the services you need in a single request, so your products are delivered ready for the production floor. Keep your project on track and within budget. Let ESCS handle lead forming & tinning, tape & reeling, dry packing, even bar coding. Need testing or de-programming? ESCS’s COTTS can handle that for you, too. Learn more.
Online Request a Quote
Why not get started now sourcing your components through ESCS? We understand your needs and can help in developing strong, risk mitigation strategies. Use our easy, online form to request a quote.
]]>When you rent an XRF analyzer from EQUIPCO you will recieve a rental instrument ready to use for your application. We provide free training and configuration at any of our locations along with discrete secure handling of your data. All of our instruments are shipped overnight and you will only be charged for the days you use the instrument.
visit our XRF rental page at:
http://www.equipcoservices.com/rentals/soil-monitory/xrf-analyzers.html
]]>i am currently the strongest archer of austria, shooting a 100 lbs compound (mathews safari); recently i am interested in the english warbow (longbow). my question is: i assume that a 100 lbs compound is more difficult to draw than a 100 lbs longbow, because peak weight starts earlier – would you agree?
anyway, i like what you do, shooting such heavy bow at your age! keep up doing it! :-)
sincerely
gregor schlögl
Is there any update on the packing material – includes the anti-staic covers, packing box etc.
Should these be RoHS Compliant?
Regards.
Kiran
Component Engineering
Tejas Networks
Thank you for the equations, but I have a question, what if after alloying they form a different phase? Will this equation still apply?
Also, could you still send me a copy of the excel spread sheet or any information you have on densities of alloys?
Thanks in advance.
Regards,
Edward
If this is not obvious to you, it is helpful to draw a simple tree enumerating all possible outcomes (a “collectively exhaustive, mutually exclusive sample set”). Then it is trivial to count up the outcomes that favor switching, and compare those to the ones that don’t. You’ll immediately see that switching confers an advantage, IF the MC has foreknowledge.
]]>Thank You in advance.
With Regards,
Ramesh
That’s probably the simplest argument.
Another argument is to use the conditional probability equation, P(A given B)=P(A and B)/P(B). In this case, let B be the event in which the host opens the door with a goat behind it. An easy mistake to make is to think this has a probability of 1, but in fact it is again 2/3. If the argument in the first paragraph isn’t convincing, think about the two cases which occur after the player picks a door:
Case 1: Player picks the door with a car. Probability that the host picks a goat: 1.
Case 2: Player picks a door with a goat. Probability that the host picks a door with a goat: 1/2.
The first case occurs with 1/3 probability and the second with 2/3 probability, so the total probability for the case in which the host picks a door with a goat is
P(player picks car)*P(host picks goat given player picks car) + P(player picks goat)*P(host picks goat given player picks goat) = 2/3.
To complete the original equation, we need P(player picks car AND host picks goat). But that should be obvious – if the player picks a car, the host necessarily has picked a goat, so it’s 1/3. And (1/3)/(2/3) = 1/2, so the probability that you picked a car GIVEN that the host picked a goat is a half as expected.
This works out even in the new scenario you outlined.
Hope this sufficiently explains things.
cxseven on gmail
]]>Thank you for your time.
Paul V. Long Jr.
Archaeologist
RoHS is the tip of the iceberg and paved the way for the much larger REACH program that will cost companies billions, put at risk companies IP.
REACH is being marketed at a greener way to test for substances and the goal is to combine all substances into one massive database so that we can “Share” in the knowledge of how substances effect our environment. However as this is generated so to is the SVHC (Substances of Very High Concern) that list those substances that the EU feels is not in the best interest of the environment (or better way to state it is the list that EU can apply a substance Tariff that will allow for the continued import.) Also a good way to get information on companies IP.
So be ready to have your checkbook ready, as it is free this year to register what it is you ship into the EU and at what tonnage you ship it. You can bet there will be a yearly bill sent to you and your company for the importing of that substance.
]]>Details are in my column in AP Semi-Monthy at www.apmag.com
regards—george
]]>This is from density = mass / volume.
First find the volume of each item.
D = M / V
10.5 = .04 / V
V silver = .0038095
D = M / V
7.31 = .96 / V
V tin = .13133
Now find the combined density
D= M / V
D= M1+M2 / V1+V2
D= .04+.96 / .0038095+.13133
D= 7.399
When you have 2 components, the combined density will be between the individual components density. You can use as many components as you like. You can use whatever units for measurement you like, but they all have to match.
]]>We use (WET WEIGHT/DRY WEIGHT x 2307.454)-2088.136 TO CALCULATE THE DENSITY OF SMELTED RAW GOLD. COULD YOU PLEASE EXPLAIN HOW THIS WAS ARRIVED AT.
GUYANA GOLD BOARD
GUYANA, SOUTH AMERICA.
I saw your requirement on informations about Cr VI issues during a survay I was working… If you are still interested on such matter, please let me know and I can give you indications about informations on SurTec website as well as contact to a fellow in US that can give you more detailed info about that!
Regards
Carlos Chaves
]]>What an adorable dog! Has your snow melted yet? Our snow in Shrewsbury MA is gone and we are eagerly anticipating a 65 degree day tomorrow! I hope all is going well. Drop me a line when you can.
Regards,
Lisa Cassinari
Millstream Associates
HR Consultant/Recruiter
www.millstreamassociates.com
please i want to buy the niton
to i so need in my work
i want to know the price for this niton
my phone :
0101215477
]]>ZrFe2 alloys
thank you
]]>I found in this article, it mensioned that this new copper connection is hard to repair or disassemble.
How about traditional Solder? As far as I know, if we find solder joint failed, we also have to take the package away, then sputter the solder paste, which is also messy. Is there any better way to repair solder make it easier than this copper connections?
Thanks,
Xi
Thanks you.
Tari
]]>He was a hero. And I have seen first hand that he can acheive all he has claimed. I challenge any of you to a dual with him…..he will be the world strongest archer
]]>Ryan
]]>I am Rick Short, Indium Corporation’s Director of Marketing Communications. More at www.indium.com/rickshort/bio.
David, thank you for your comment to Dr. Lasky’s posting. Fellow technologists like you are what make this industry so fun and interesting. You help us, you keep us on our toes, and we all grow together.
Indium is a technology-based company that builds virtually everything we do on scientific reasoning and logic – at least we try to. Dr. Lasky’s blog is a testament to that. As he has written on his sideblog, ...“I am pro data driven decision making”.
Therefore, Indium Corporation doesn’t “worry about” technological developments in materials or processes. Instead, Indium strives to focus on developing, and keeping abreast of other’s developments, in these areas.
We know change is inevitable and desired. We aim to be that (positive) change, as best we can.
Dr. Lasky’s statement regarding being a data-driven decision maker has at least two critical elements:
1) data and data-driven: we strive to either create or accumulate, then analyze good data.
2) decision making: with this data, and our analyses, we strive to use good decision making to chart our course.
This is certainly not unique to Indium Corporation, but it is part of our corporate core.
So, we are not worried about new technological developments. Such events are what has allowed our company to grow and thrive for the past 74 years. We embrace change and growth. Occasionally we get caught out, or a competitor outdoes us, or we fail to identify a technological trend in time. Occasionally we come out on top. Either way it is the constant stress and pressure, the test, and the competition that combines with our innate technological curiosity to make us better.
I have been in this industry for 24 years and I can confidently say that virtually all of Indium’s global competition could have written the same comments. This is a good industry – full of curious, capable, and smart people.
Whatever happens – it will benefit us all.
Thanks, David. Keep the good stuff coming.
]]>I accidently posted this on your earlier blog and am not sure if you read the earlier reponses so I am sending it again here.
I thought you would find the article below of interest. Is appears that now there is more that just Occam to worry about. It looks like Georgia Tech is now promoting solder free assembly also. Do you think that solder on its way out?
Thanks,
David
Copper Pillars Poised to Replace Solders
Wednesday, February 13, 2008|Georgia Institute of Technology
As computers become more complex, the demand increases for more connections between computer chips and external circuitry such as a motherboard or wireless card. And as the integrated circuits become more advanced, maximizing their performance requires better connections that operate at higher frequencies with less loss.
Improving these two types of connections will increase the amount and speed of information that can be sent throughout a computer, according to Paul Kohl, Thomas L. Gossage chair and Regents’ professor in Georgia Tech’s School of Chemical and Biomolecular Engineering. Kohl presented his work in these areas at the Materials Research Society fall meeting.
The vertical connections between chips and boards are currently formed by melting tin solder between the two pieces and adding glue to hold everything together. Kohl’s research shows that replacing the solder ball connections with copper pillars creates stronger connections and the ability to create more connections.
“Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also,” said Kohl.
Solder and copper can both tolerate misalignment between two pieces being connected, according to Kohl, but copper is more conductive and creates a stronger bond.
With funding from the Semiconductor Research Corporation (SRC), Kohl and graduate student Tyler Osborn have developed a novel fabrication method to create all-copper connections between computer chips and external circuitry.
The researchers first electroplate a bump of copper onto the surface of both pieces, a process that uses electrical current to coat an electrically conductive object with metal. Then, a solid copper connection between the two bumps is formed by electroless plating, which involves several simultaneous reactions that occur in an aqueous solution without the use of external electrical current.
Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. All-copper connections between computer chips and external circuitry will lead to increased computing speeds. (Image courtesy of Tyler Osborn)
Since the pillar, which is the same thickness as a dollar bill, is fragile at room temperature, the researchers anneal it, or heat it in an oven for an hour to remove defects and generate a strong solid copper piece. Osborn found that strong bonds were formed at an annealing temperature of 180 degrees Celsius. He has also been investigating how misalignments between the two copper bumps affect pillar strength.
“I’ve also studied the optimal shape for the connections so that they’re flexible and mechanically reliable, yet still have good electrical properties so that we can transmit these high frequency signals without noise,” said Osborn.
The researchers have been working with Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl, director of Georgia Tech’s Microelectronics Research Center and professor in the School of Electrical and Computer Engineering, and Sue Ann Allen, professor in the School of Chemical and Biomolecular Engineering, have also collaborated on the work.
In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing an improved signal transmission line with the help of graduate student Todd Spencer.
“Several very long communication pathways exist inside a computer that require a very high performance electrical line that can transmit at higher frequencies over long distances,” explained Spencer.
This is especially important in high-performance servers and routers where inter-chip distances can be large and signal strength may be significantly degraded. Kohl and Spencer have developed a new way to link high-speed signals between chips using an organic substrate, with funding from the Interconnect Focus Center, one of the Semiconductor Research Corporation/Defense Advanced Research Projects Agency (DARPA) Focus Center Research Programs.
Fabrication begins with an epoxy fiberglass substrate with copper lines on one side. The substrate is coated with a polymer and the areas without copper lines are exposed to ultraviolet (UV) light, which disintegrates the polymer where it’s not wanted. Then, the researchers coat the substrate with another polymer that hardens when exposed to UV light. Layers of titanium and copper are added on top of each copper line. When the layered substrate is heated at 180 degrees Celsius, the first polymer layer decomposes into carbon dioxide and acetone, which diffuse out leaving an air pocket.
“The amount of electrical loss relates to the connection’s sensitivity at higher frequencies,” explained Spencer. “Just having this air pocket there reduces our signal loss greatly.”
The researchers are currently designing a coaxial cable for this chip-to-chip signal link, which should greatly increase the maximum signal frequency the connection can carry.
Companies that make computer chips and package them into a device are very interested in these technologies, said Kohl.
“If these connections can be produced at a reasonable cost, they could be very important in the future because you’re giving the customer a better product for the same cost,” said Kohl.
]]>I enjoy reading your blog.
I thought you would find the article below of interest. Is appears that now there is more that just Occam to worry about. It looks like Georgia Tech is now promoting solder free assembly also. Do you think that solder on its way out?
Thanks,
David
Copper Pillars Poised to Replace Solders
Wednesday, February 13, 2008|Georgia Institute of Technology
Improving these two types of connections will increase the amount and speed of information that can be sent throughout a computer, according to Paul Kohl, Thomas L. Gossage chair and Regents’ professor in Georgia Tech’s School of Chemical and Biomolecular Engineering. Kohl presented his work in these areas at the Materials Research Society fall meeting.
The vertical connections between chips and boards are currently formed by melting tin solder between the two pieces and adding glue to hold everything together. Kohl’s research shows that replacing the solder ball connections with copper pillars creates stronger connections and the ability to create more connections.
“Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also,” said Kohl.
Solder and copper can both tolerate misalignment between two pieces being connected, according to Kohl, but copper is more conductive and creates a stronger bond.
With funding from the Semiconductor Research Corporation (SRC), Kohl and graduate student Tyler Osborn have developed a novel fabrication method to create all-copper connections between computer chips and external circuitry.
The researchers first electroplate a bump of copper onto the surface of both pieces, a process that uses electrical current to coat an electrically conductive object with metal. Then, a solid copper connection between the two bumps is formed by electroless plating, which involves several simultaneous reactions that occur in an aqueous solution without the use of external electrical current.
Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. All-copper connections between computer chips and external circuitry will lead to increased computing speeds. (Image courtesy of Tyler Osborn)
Since the pillar, which is the same thickness as a dollar bill, is fragile at room temperature, the researchers anneal it, or heat it in an oven for an hour to remove defects and generate a strong solid copper piece. Osborn found that strong bonds were formed at an annealing temperature of 180 degrees Celsius. He has also been investigating how misalignments between the two copper bumps affect pillar strength.
“I’ve also studied the optimal shape for the connections so that they’re flexible and mechanically reliable, yet still have good electrical properties so that we can transmit these high frequency signals without noise,” said Osborn.
The researchers have been working with Texas Instruments, Intel and Applied Materials to perfect and test their technology. Jim Meindl, director of Georgia Tech’s Microelectronics Research Center and professor in the School of Electrical and Computer Engineering, and Sue Ann Allen, professor in the School of Chemical and Biomolecular Engineering, have also collaborated on the work.
In addition to this new method for making vertical connections between chips and external circuitry, Kohl is also developing an improved signal transmission line with the help of graduate student Todd Spencer.
“Several very long communication pathways exist inside a computer that require a very high performance electrical line that can transmit at higher frequencies over long distances,” explained Spencer.
This is especially important in high-performance servers and routers where inter-chip distances can be large and signal strength may be significantly degraded. Kohl and Spencer have developed a new way to link high-speed signals between chips using an organic substrate, with funding from the Interconnect Focus Center, one of the Semiconductor Research Corporation/Defense Advanced Research Projects Agency (DARPA) Focus Center Research Programs.
Fabrication begins with an epoxy fiberglass substrate with copper lines on one side. The substrate is coated with a polymer and the areas without copper lines are exposed to ultraviolet (UV) light, which disintegrates the polymer where it’s not wanted. Then, the researchers coat the substrate with another polymer that hardens when exposed to UV light. Layers of titanium and copper are added on top of each copper line. When the layered substrate is heated at 180 degrees Celsius, the first polymer layer decomposes into carbon dioxide and acetone, which diffuse out leaving an air pocket.
“The amount of electrical loss relates to the connection’s sensitivity at higher frequencies,” explained Spencer. “Just having this air pocket there reduces our signal loss greatly.”
The researchers are currently designing a coaxial cable for this chip-to-chip signal link, which should greatly increase the maximum signal frequency the connection can carry.
Companies that make computer chips and package them into a device are very interested in these technologies, said Kohl.
“If these connections can be produced at a reasonable cost, they could be very important in the future because you’re giving the customer a better product for the same cost,” said Kohl.
]]>Thank you for the information. Kindly send the excel file.
Thanks a lot
]]>Our company has the availability of 5 tons/month of Tin Rohs (94%-Tin, 3%-Copper, 3%-Silver). Can you refer me to a party who might be interested in the procurement of this material.
Sincerely, Ami 917-294-8801 Cell]]>Please contact me.
Thanks
David Baker
]]>Please contact me.
Thanks
David Baker
]]>Get a bow scale. They go up to 90 pounds and you can pull at several distances and plot a graph. Surprisingly the bows are very linear.
I think Jay St Charles at Pacific Yew Classics could make you a 100 to 130 poind bow at 32-34 inch draw.
Find him with Google.
Best,
DR
]]>Any advice on measuring?
]]>As for the build-up on our site, I’d refer you to Ray Rasmussen. He is a big believer in Occam, and his columns reflected his opinion—not our Web site’s.
Ken, I’d be glad to discuss this with you further (530-852-7076).
Thanks for your blog, Ron.
Steve
]]>thanks for this formular.However, could you send all formation about density for me please.
thanks.
]]>Soon, we will be unable to do this as the lead free solder will be difficult to remove while leaving the parts intact – which means more waste!
What I find most irritating is that the building industry is still allowed to use lead flashing on roofing – which is directly eroded by rain and ends up in the soil and water system – far more polluting than waste electronics!
]]>I don’t think the bet is a good one because the probability that there are at least two persons were born in the same day is 0.948.
It is not difficult to calculate once you know the method. Somebody reminded me that this kind of questions like the “Birthday Paradox”.
Thanks,
Anny
]]>I don’t think the bet is a good one because the probability that there are at least two persons were born in the same day is 0.948.
It is not difficult to calculate once you know the method. Somebody reminded me that this kind of questions like the “Birthday Paradox”.
Thanks,
Anny
]]>Thanks in advance.
]]>Professional equipment, which typically has a lifespan of 20+ years, is unable to use minute quantities of leaded solder, meaning that repair work will typically increase the risk of damage to the PCB due to the higher temperatures involved, yet it’s not allowed any lead content in the solder, but batteries and CRTs can go on regardless?
And we haven’t touched on the subject of tin whiskers yet…
Why is that, when you read the exemptions lists, the more political lobbying power an industry has, the more exemptions it will have?
Why have the major consumer electronics OEMs been so quiet on this issue, yet the retooling has cost them millions of dollars / Euros? Could it be because they know the legislation will put every OEM on a ‘level playing field’, whereby nothing lasts longer than 3 or 4 years?
What do the lead-free proponents have to say to Howard Johnson, Phd, who believes the ROHS legislation will create infinitely more damage to the environment than prevent? http://www.edn.com/article/CA6477864.html?nid=2431&rid=203930815
Does anyone here know their subject better than Johnson? Is he ill-informed?
The ROHS legislation is a classic example of what occurs when bureaucrats, with no qualification or experience whatsoever within the industries over which they legislate, are allowed free-reign to make laws.
I fully support the majority of ROHS goals, such as cadmium reduction. However, by not letting OEMs use a few milligrams of lead, I believe the days of buying a hi-fi or TV that will last 20+ years are over. The bureaucrats obviously believe we are all mindless consumers who change our electronics every couple of years…and that there is no such thing as professional electronics… With the death of reliable electronics, what about the carbon footprint created by the extra production of new equipment needed to replace that which is either un-repairable (due to high iron temperature harming the PCB), or possessing complex faults due to tin whiskers? How many consumer appliances are repaired these days anyway? Wouldn’t it be better to prevent them malfunctioning in the first place?
Justin
]]>Here is a way to look at it that I think makes it more clear.
Let’s say there are 1000 doors. There is one car behind one door and one goat behind each of the other 999 doors.
You are asked to make your selection and you choose door number 137. Let’s now consider that we have two sets. Set #1 consists only of the door you chose, number 137. Set #2 consists of the remaining 999 doors. The chance that the car is in set #1 is 1/1000 and the chance that it is in set #2 is 999/1000.
Assume the host opens all doors in set #2 except door number 641. All of the 998 doors that are open reveal a goat. Whether he knew or not where that car was, there still is a 999/1000 chance that it is in set #2.
So if you are allowed to switch in this case. your chances go from 1/1000 to 999/1000.
Cheers,
Dr. Ron
Some exempted manufacturer’s have also been forced to have the component “re-balled” in situations where the leaded (contains Pb)component has been discontinued, and is only available in a 6/6 version.
Many of the major Telcom providers continue to mandate that their equipment suppliers have Pb in their gear . . . tin whisker and reliability concerns are getting a lot of attention!
]]>single side of components limits density we are already making HDI boards with both sides full of chips and comonents .
No new density improvemnt, we already use via in pad so where will Occcam reduce layer count.
each single layer of which there may be 10 to 16 must be processed one at a time , time is money my early estimates would put Occam at 200 to 500 percent more expensive.
the weight of the ecapsulant is a problem in critical weight air frame applications.
there will not be the millions of KW reduction in electrical , the IR oven is mearly replaced by larger cure ovens for the ecaspulant . also we laminate all 10 to 20 layers of a multilayers in one pass , with Occam we need a seperate lamination cycle for each layer, driving up the KW hour meter.
If we loose a cicuit due to the all to possible circuit trace nick or open we also throw away expensive chips and components, driving the potential cost up.
nice Idea but I belive its not practical at this time.
]]>Actually, I believe both the earlier Discover article, and Marilyn Vos Savant are correct. I posted comments at:
http://www.indium.com/drlasky/entry.php?mode=add&id=506
and
http://www.indium.com/drlasky/entry.php?mode=add&id=510
describing why I believe this.
]]>Let’s call the the doors G, B1, and B2. We want the probability that we picked G given that the host shows B1 or B2. This is the probability that switching is the wrong thing to do. So, call event A, “we picked door G,” and call event B “the host shows us B1 or B2.”
event B: the host shows us B1 or B2
There are 4 ways this could happen:
1) we pick G (which happens 1/3 of the time) and the host shows us B1 (which happens half of the times that we pick G):
(1/3)*(1/2) = 1/6
2) we pick g (which happens 1/3 of the time) and the host shows us B2 (which happens half of the times that we pick G):
(1/3)*(1/2) = 1/6
3) we pick B1 (1/3 of the time) and the host shows us B2 (half of the times we pick B1):
(1/3)*(1/2) = 1/6
3) we pick B2(1/3 of the time) and the host shows us B1 (half of the times we pick B2):
(1/3)*(1/2) = 1/6
So P(B)=4/6=2/3.
event (A and B): we pick door G and the host shows us B1 or B2 If we pick G (which we do 1/3 of the time) the host will always show us either B1 or B2. So P(A and B)=1/3*1=1/3.
This gives P(A|B)=(1/3)/(2/3)==1/2. So if the host shows us the wrong door, we’ve picked the right door half of the time. Therefore, switching has no advantage.
It is very counter-intuitive that this would be different than the case where the host knows the correct door. Doing the calculations might help show why. If we assume the host knows the correct door, and will always show us an incorrect door, we have different probabilities. In this case:
event B: the host shows us B1 or B2
The problem states that the host always shows us an incorrect door. So P(B)=1
event (A and B): we pick door G and the host shows us B1 or B2
This is the same as the unknowing host. If we pick G (which we do 1/3 of the time), the host will show us B1 or B2 every time. So, P(A and B)=1/3*1=1/3
So P(A|B)=(1/3)/1=1/3. This means that if the host shows us an incorrect door, we’ve picked the right door 1/3 of the time. So switching wins the prize 2/3 of the time.
]]>You are correct. I solve the problem folling your lead for 50,000 years using Excel.
I will print a correction soon, after I clean the egg off of my face and let my recent posting have time to be read.
Thanks for your time and effort. My assumption that the author simply took the inverse of 1/1743 was wrong and unfair to him. I also assumed (wrongly) that the median and mean would be close in value.
Well, my hope is that we all learned something.
Thanks again,
Dr. Ron
]]>As stated in your post, you’ve computed the median. This is one possible interpretation of the word “average.” I would argue, though, that a more common interpretation of the word “average” is “mean.” For example, what if I asked you for the average of the following numbers: 1, 2, 3, 4, 100? Would you answer 3, which is the median? Or, would you answer 22, which is the mean?
Dickenson has, in fact, correctly stated the mean (or expected value). To compute the expected value of a random variable, we multiply each possible outcome by the probability
of that outcome and take the sum of the products. For example, if we have a population in which 20% of the people make $10/hr, 70% make $20/hr, and 10% make $30/hr, the mean
income for the population is:
0.2*10 + 0.7*20 + 0.1*30
So to compute the mean age at which someone would die, we have to figure out all of the possible ages at which they could die, multiply each age by the probability of dying
at that age, and add up the products.
Year 1 is easy enough. There’s a 1/1743 chance that the person dies, so we multiply that
by 1 and get:
1/1743 * 1
Year 2 isn’t so bad. To die in year 2, first they have to survive year 1. The probability of that is 1742/1743. Then, they have a 1/1743 chance of dying. So for year 2, we have
(1742/1743) * (1/1743) * 2
For year 3, they have to survive years 1 and 2, and die in year 3. So we have:
(1742/1743)^2 * (1/743) * 3
And in year 4:
(1742/1743)^3 * (1/1743) * 4
In general, the probability of dying in year y is:
(1742/1743)^(y-1) * 1/1743
multiplying by the year gives us:
(1742/1743)^(y-1) * 1/1743 * y
So, now we just have to add all of products. This gets a little ugly, because there are an infinite number of things to add. We have:
sum[y=1->inf] ( (1742/1743)^(y-1) * (1/1743) * y )
Assuming you don’t do binomial expansions every day, it might be easier to estimate the solution to this rather than solve it exactly. Here is some perl code do do that. It only considers the people who live less than 1000000 years. Since only 0.<247 zeros go here>580511580314418 percent of the people are still alive at 1000000 years, this is a pretty good estimate.
————————————-
#!/usr/bin/perl
$tot=1000000;
$base=1743;
$avg=0;
$stillalive=1;
for($i=1; $i<$tot; $i++) {
$avg+=(1/$base)*$stillalive*$i;
$stillalive*=($base-1)/$base;
}
print “avg $avgn”;
————————————-
For the sake of completeness, we can use the following:
1/(1-1/x)^2=1+2/x+3/x^2+4/x^3+5/x^4+...
which I found here:
http://www.jimloy.com/algebra/series.htm
to solve the equation exactly.
So we rewrite:
sum[y=1->inf] ( (1742/1743)^(y-1) * (1/1743) * y )
as
(1/1743) * ( sum[y=1->inf] ( (1742/1743)^(y-1) * y ) ) )
let x=1743/1742:
(1/1743) * ( sum[y=1->inf] ( y/x^(y-1) ) )
or
(1/1743) * (1+2/x+3/x^2….)
The equation from jimloy.com tells us the sum of the series, so we have:
(1/1743) * 1/(1-1/x)^2
plugging 1743/1742 back in for x:
(1/1743) * 1/(1-1/(1743/1742))^2
(1/1743) * 1/(1-1742/1743)^2
(1/1743) * 1/(1/1743)^2
(1/1743) * 1743^2
1743
I was going to comment that this seems like a bit more work than your statement “It appears he just inverted the 1/1743.” implies. However, if we went back through the math and used 1/p instead of 1/1743, we’d get a mean of p. So, in this type of problem, you can just invert the probability to get the mean. You won’t get many points for showing your work, though.
So, assuming Dickinson means mean, then the solution is not only not not even wrong, but also not wrong.
]]>I say you can do 160+ you only live once
]]>I believe that, just because a product is more easily/efficiently recyclable, doesn’t mean that it also has to be “disposable”. It’s just smart.
Competitors battle on many fronts. Some common areas of differentiation include: service, price, total cost of use, performance, quality, product life, image, brand, prestige, convenience (and many more).
We all purchase one or more products for their durability (versus the competition). My son recently selected a product (snowmobile clothing) because it was of high quality/performance and would last longer than the alternatives – and the item happens to be easily reusable and recyclable (he hopes to delay the inevitable for a good long time).
Today’s electronics goods (especially consumer electronics) themselves are blamed (at least their manufacturers are) for being designed to have a short useful life.
I contend that, for the most part, for mainstream vendors, the devices are designed to last a useful life based on the degree and pace of software/hardware/application innovation that occurs. It is very unlikely to be able to design a cell phone today that will competitively deliver all the converging performance requirements that will be de rigueur in 2017. In such a case, a 2016-designed competitive device would surely render a 2007 device completely obsolete and uncompetitive (who knows what we will be doing with a “cell phone” then???).
Our issue isn’t that companies want to design and produce near-term waste. The fact of the matter is that we are in a period of tremendous technological growth.
Given that truth, we owe it to ourselves, and the environment, to control our consumption. That includes reducing the sheer volume of stuff we accumulate (production reduction) as well as demanding that everything we DO consume be more easily reusable/recyclable.
Thanks for sharing your thoughts. This is healthy!
]]>But you said yourself : “in 2007 it is impractical to expect to use a laptop for 10 years (though it should be a design goal).”
But if I am an electronic manufacturer and I make products to last more than 50 years, with proven building quality and sufficient proven customers interest ?
With RoHS, there is no reason to build electronic quality products anymore, as the recycling is at design step
That makes no sense to me, where the world is going to go with this concept in mind ?
When you plan to make a baby, do you plan also his/her interment ?
]]>@Keefaz: Your sentiment is spot on. I agree! But, there is an old saying, “If you fail to plan, you can plan to fail.”
Planning for end of life is not a bad thing. Designing products to be recyclable is better than having no plan for end of life.
I agree that products should be more robust, used more/longer, and even reused. For example, I would love to use ONE laptop for 10 years. That said, in 2007 it is impractical to expect to use a laptop for 10 years (though it should be a design goal).
And it should also be a design goal, when that laptop is discarded, that it present a minimized threat to our waste stream.
When building anything, we should plan for end of life. If not, we can plan to fail our environment.
]]>Thank you for your continuing interest in Occam. You have become one the most consistent commentors on the technology and we at Verdant Electronics (www.verdantelectronics.com) are honored by your attention.
The First International Occam Developers Conference was held yesterday October 16 and was attended by enthusiastic individuals from 4 continents. You had previously asked for a savings estimate and the consensus is coming in at 25-35% excluding electronic components.
I appreciate the example you have shown and trust that you do not think that the Occam process was being targeted to replace everything in electronics overnight. Occam will find its place and no doubt, solder will continue to be used for many years to come in many applications. Still change is the only universal constant and tomorrow will be different from today.
Thanks again for all of the attention you are giving to Occam, Ron.
Kind regards,
Joe
I don’t think the bet is a good one because the probability that there are at least two persons were born in the same day is 0.948.
It is not difficult to calculate once you know the method. Somebody reminded me that this kind of questions like the “Birthday Paradox”.
Thanks,
Anny
]]>Think about BASIC economics for a moment. Microsoft and Motorolla want their products to break down after a few years, creating more sales. Being ROHS complient helps their bottom line. NASA and BOEING, on the other hand are very firm that they will pay what ever fee/ fines because they know that lead-free products are inferior.
]]>Congratulations! All the best wishes to you all!
]]>I will address your comment, “I along with your other occasional readers realize that you have paid job to protect the solder industry” with two brief points:
1) a personal attack (versus putting forth the virtues of your process) is a very telling response.
2) as a close colleague of Dr, Lasky, I can tell you that his singular assignment and mission is to explore, work, and comment from a purely technological perspective. He has NEVER been instructed to take any position. Anyone who knows him knows that he would rather quit than behave in that manner.
I’ve heard nothing but great things about you, Joe, from trusted friends (we have never met). In that spirit, let’s get this whole thing on the proper track so that the industry benefits from whatever the outcome may be.
]]>Dr Lasky is the only person who seems to have raised questions about the viability of the process. Instead of rising to the challenge of his arguments with meaningful responses, all I have seen is sniping and “playing to the gallery” about resistance to change. This is the kind of tactic employed by teenagers when embroiled in an argument with an intellectually superior but less socially powerful opponent.
Something is not quite right about this whole Occam thing, but I’m damned if I can put my finger on it…
]]>Thank you for taking time out to attend the webinar and sharing your thoughts with your readers and as well for your kind words about me.
I would like to invite your readers who have interest to hear first hand my comments to listen to the webinar to go to the Verdant website
www.verdantelectronics.com
There they will find a link to the webinar in its entirety and make their own judgements. There is a fee to attend but if any of your readers or their companies feels that they cannot afford the relatively small fee, they can contact me directly and I will make the arrangements for them to attend for free.
Your prominent placement of Edison in your commentary is truly appreciated. I am reminded of a story that he announced at least one of his inventions before he had done any development. He simply knew that it would work. The Occam, “concept”, if you wish, is similar and it has been acknowledged as viable by the best and brightest interconnection technologist in the electronics industry.
I would like also to remind you that the first public announcement of the launch of Verdant Electronics and the Occam process is now slightly over one month old. Give it some time, my friend, and let’s revisit this matter in the not too distant future.
Kind regards and best wishes,
Joe
(I believe I did answer the question number 7 during the course of the seminar by the way ;-)
]]>Thank you for your ongoing efforts to highlight and keep dicussion of the Occam Process moving forward.
I wanted to let you know that there will be a webinar on the topic the second week of September information on it can be found at the followig website.
http://www.verdantelectronics.com/webinar.php
I hope that you will be able to listen in. It will be available for listening afterwards if you do not have time on the day of the presentation.
Kind regards and best wishes,
Joe
I agree with the all the points you have articulated. I would like to add my 2 cents regarding cost. –
1) laser drilling = expensive
2) encapsulation = expensive.
3) electro-less plating = expensive
4) cost due to yield fall-out = very, very expensive.
Could you expand on your comment (for lead-free SAC 387 tends to tombstone more than SAC 305)?
Thank you,
Lane
Many of the materials from the wiring harnesses to be tested can be seperated into homogenous materials in a sample cup to be placed on the tester’s aperature. By using a sample cup, it is easy to cut up bits of insulation to cover the aperature to the appropriate depth.
A small circuit board in the harness was the most troublesome. We removed the brass parts that were riveted to the board and got high lead readings in the area of the board with the largest solder pads. Per the proper use of the tester, we took the course of telling the appropriate people that we had suspicion of lead in that area.
With more work, we showed that the lead reading disappeared with the removal of a diac.
Since we were in the learning process, we also asked the maker of the tester to use the parts to give us a video conference demo of a small bench top unit where the beam size is adjustable.
Using a 2mm beam they could watch the readings as they moved the test point (visible with cross hairs on a video screen) across the suspect part (both on the board and as a seperate part).
The bench top unit was easily able to identify that it was the body of the diac that contained the lead and not the leads or other materials on the circuit board.
A question to the maker of the board got the information that they knew that there was lead in the glass bead encasing the part and that it was exempt.
The hand held XRF tester did it’s job and started further testing.
]]>I appreciate your skepticism and the challenges that you present. I along with your other occasional readers realize that you have paid job to protect the solder industry.
Challenge is actually a good thing, both for new ideas and the status quo, for as Nietzsche said: “That which does not kill us makes us stronger” and I would add smarter, as well.
For your benefit and the benefit of your readers who share your views, a cost analysis is in the works. Of course, it too will be open to challenge by you when complete.
This too is OK, for as one of my advisors with a long history as an electronics assembler recently said, “I can come up with a hundred reasons why this won’t work for everything, but my intuition is that it will very well for many things”. (Fortunately it does not have to work for everything to provide benefits to electronics.)
Another advisor wisely observed: “If the Occam Process wasn’t important and potentially hugely disruptive, no one would be saying anything” Thus thanks are due to you for the attention that you have given the process on your blog and in the press. It has been a great service to introducing and advancing the Occam concept to a broader audience.
Personally, I have much greater faith in the talent and creativity of engineers and scientists to make changes than I do in MBAs who know the price of everything and the value of almost nothing.
You and anyone else who cares to read the postings on the IPC’s technical chat boards, is acutely aware of the mounting problems faced by manufacturers. The simple fact is the the removal of lead from solder has resulted in a transition where solder has moved from loyal servant to merciless tyrant forcing the waste of billions of dollars with no environmental benefit at the end of the day. The overwhelmingly positive response the Occam concept has enjoyed is, I believe, a reflection of that simple fact. Where some see only insurmountable walls, others see doors.
Victor Hugo said it well “Nothing is more powerful than an idea whose time has come”
The idea of low temperature, solder-less assembly of electronics is now out of the bottle and I assert here without proof that many folks in labs around the globe are now working in labs to find ways to come up with their own concepts to accomplish that objective as well. I encourage and applaud them in their efforts.
I would add finally, that the surface mount industry was not born like Venus fully grown from and oyster shell. All transitions take time and change, if it provides benefits, happens whether we like it or not.
I look forward to checking back with you on this topic in the not too distant future.
Best wishes,
Joe
As tin is the major material used in lead free soldering, and it’s source is decreasing each year, is there any prediction of other metal/substance that can replace it?
Thanks&Regards,
Lisme
I would like to know more about the output of CONCIBE 2007 especially pertaining to the RoHS directive compliance, issues related to it, current challenges and any other recent information on the exemptions.
Thanks and regards
]]>Thanks,
Andy
Thanks,
Ken Friedman
ACI
www.aciusa.org
We are a start-up company manufacturing ultra-fine metal powders and alloy powders. We majorly produce indium powder, In/Ag, In/Sn, Sn/Ag and Sn/Ag/Cu alloy powders. 75-45΅m, 45-20΅m is normal size range that we supply for our customers, our specialty is 10-1΅m.
My question is:
1. Is the industrial trend going to smaller particle size, such as type 7(10-1΅m), although it is not on the IPC J-STD-006 specification?
2. What do you see the future for indium/alloy powders supplier like us?
3. Will RoHS/WEEE, the Lead (Pb) free legislation in North America giving us more chance in the market?
4. Do you think SAC305 is the only and the best solution for lead-free industry main market?
Thank you in advance for your reply.
Julia
Tel:972-200-5667
Email: julia_hl@hotmail.com
I am the Real Den Erickson , I am posting this as I had no idea someone had placed posts in my stead.
I believe Mr. Peter White out of Australia had something to do with this , however ,
I spoke With Mr. Stretton On the phone today apologizing for the strife the posts on this site have cost him.
Mr. Stretton has been a Gentleman in regard to how he has handled things thus far with me , and I thank him for it .
To My Fans, and to Mr. Stretton's Fans Please No more derogatory Postings of any kind .
May we please move forward and Show our pride for our accomplishments in a manner befitting the atheletes and sportsmen that we are .
I am moving forward with my records, that are in no way connected to Mr. Stretton .
I do wish Mr. Stretton the Best Of luck with all his endevours!
As I stated Sir, If you ever Wish a hunt out here in the States, You are Certainly Welcome with us any time!
]]>Dr. Lasky I Sincerely Apologize For the improper use of your forum , I did not realize that the British Folk would have stooped so low as to discredit me in this fashion.
Please accept My interest and set up the trials any time after July 18th .
My Thanks ,
Den Erickson
Please Mr Den, give us a link wich shows you drawing these mighty bows you claim so we can see for ourselves, don't try and sell us a video as there have been stories of you conning people of their money, You seem to have a very high opinion of yourself and as such must have pictures of yourself, well let's see some. Just to show you i am not afraid of showing myself here is a picture of me shooting a 105lb Self Yew bow.
Cheers
Steve
]]>Thanks
]]>Mr. Stretton and I have cooresponded and made it quite clear not to include each other in anything relating to this, I stand by that , and I apologize that you were pushed into this at all.
If any one doubts my Strength, or my shooting ability , Please by all means shoot with me , stand to my face when you cast your insults , Instead of using a cowardly forum in which you may hide Sniveling like a pack of old ladies .
I have never suffered insults well ,and as I am not the best looking Gent out there , I have heard a few, but never to my ugly Scarred face , a face that has been scarred by war and atrocities that no one should ever have to go through . By all means insult me if it makes you feel any better , feel free.
Den,
I have simply referred it to those who made the decision to list the information and courteously Cc:ed you so that you are aware and can take whatever action you see fit. Similarly I have kept Tradekey.com in the loop. Provide them your proof and I'm sure they will remove it and advise me.
Regards
Peter
----- Original Message -----
From: VARBOGEN@aol.com
To: pwhite60@pcug.org.au
Sent: Monday, May 28, 2007 1:20 PM
Subject: (no subject)
Coward
**************************************
]]>Due Diligence ?
I had not read anyting on Dr Lasky's forum. however if you are an ebay familiar then you know how fickele these people may be , I have never scammed anyone , I was the one nailed as I had to pay for not only the merchendise , but also never get paid for it the so called consumer had the money and the product . Be wary the lies others spread may bite you .
If you have nothing to do with me , then you have no business getting involved , do you , no.
If you your wife or children or other family member had something in thier " closet " is it any business of mine , no , and I could care less , ebay has fueled a sickness in the world economy as much as the good it has done . I choose not to have anything to do with it even after proved my point with ebay and cleared my name .
If you are not willing to retract your so called issue with me I will use every avenue available to me to make sure you will never be able to slander or liable anyone else again . You and I have no business with each other , therfore you must retract it , I have never wronged you , therefore you must retract it .
I do not wish to make this more of an issue than you already have , fix this please . Retract it now ?
Best Wishes,
Den
**************************************
]]>Guiness has been contacted and we will proceed when they have agreed to a date .
Any questions Please email .
Varbogen@aol.com
Thanks ,
Den Erickson
Dear Peter,
Thank you for sending your feedback. Your feedback has been acknowledged, approved and sent to the recipient.
Recipient Details:
Company name: Varbogen Pro Shoppe
Contact Name: Den Erickson
Email: Varbogen@aol.com
Telephone: 01-262-6974007
Fax:01-262-6974007
Feedback Details:
Rating: 1
Comment Status: Approved
Date: May 23, 2007
Message: Fair warning to all. I make no claims as to the accuracy of the information provided below but have come across other comments from his peers in archery forums which question this man's credability that should be raised with him directly if contemplating business activity.
This was found on a website http://www.indium.com/drlasky/entry.php?id=386
13. John Ledford:
NoSpinZone06: wrote "The only so-called claim to fame Den Erickson has in terms of "The Worlds Best" is quite possibly the world's best con-man."
He not only pulls your leg but he will take your money and run! He had advertised selling W&W Xpert riser on eBay. I have documentation to prove that he received and cashed the money order sent via certified mail. Then he dissapeared, never sent the paid for riser and stopped returning phone calls or emails.
I also corresponded with another eBay member that he cheated, who purchased riser and limbs and never received it.
Den Erickson is a liar and a cheat and I urge you good folks in the archery community to spread the word not to purchase anything from Varbogen Archery.
How someone with a retail archery business can be so unethical is beyond me. I'm pretty sure that at least 200 of his advertised 280lbs is BS!
Attachment: None
Admin Comments: None
For further questions, issues, or feedback, please write an email to feedback@tradekey.com. Please remember to include your Feedback ID in the subject line.
TradeKey.com
----- Original Message -----
From: VARBOGEN@aol.com
To: pwhite60@pcug.org.au
Sent: Monday, May 28, 2007 5:33 AM
Subject: (no subject)
What Business Do you have with me ?
I do not know you . Yet you are attempting ti Lieble me .
**************************************
Response sent Sent: Monday, May 28, 2007 5:33 AM
Den,
Firstly, the comments went through the Tradekey.com site's administrators who decided whether it was valid, justified, relevant that I was passing it on without direct contact with you and finally to list the information and advise you. Please read what I wrote I made no claims to the accuracy of the information simply pointing out that it was there and people should raise it with you if they wanted to do business. I have been ripped off in a similar way on e-Bay and know how frustrating it can be and how preventable if people share information about their experiences. Its called due diligence.
If you had responded to the original claims on the source website http://www.indium.com/drlasky/entry.php?id=386, I would have posted them as well ( you still can). On another archery website your flippant response to it being mentioned was that you were honoured to be found on Google. Your fame increases.
Regards
Peter (The World's Greatest Me)
AUSTRALIA
Thanking You in advance.
With Regards,
Skb.
]]>Pulls are one form; another is test rejects that are not properly destroyed. Still another is remarking legit parts as higher-performance items...an issue particularly with processors.
Counterfeiters have also become expert at faking the packaging the parts are sold in - the boxes/labels/etc. Without full testing and/or opening up the parts themselves its getting increasingly difficult to sort out the fakes.
I look forward to reading your article.
]]>B K SONI
INFOTREK SYSCOM LIMITED
BOMBAY, INDIA
+91 9867729662
The value of tin + silver in a kg of solder has gone from about $10 to about $20.
Much of the value of a solder wire or paste is in the fabrication, thus the price of a $140 kg can of solder paste only went up by 7% for this doubling.
]]>We have a component that per the vendor is RoHS compliant, but when we had a RoHS compliant scanner demoed it showed the component had a high percentage of lead. I am trying to figure out how we know if a component is RoHS compliant due to an exemption (i.e lead in the glass that is used) or is really RoHS compliant.
Any clarification you could give would be helpful.
]]>Not long ago, the EU TAC issued an exemption allowing the use of lead
In the finish of components that had a very small distance between terminations. Lamentably, this was a case of too little, too late. Tin whiskers can get very long. While not common, cases have been found with a length approaching two centimeters. I published a paper five years ago on a spectacular failure of an electronic component used in a military system. It failed after over a decade in the field due to whiskers that grew inside. A similar unfailed component when opened had hundreds of whiskers longer than one centimeter.
Besides, by the time that the permission to use lead was issued, component manufacturers had already switched to lead-free tin. It isn't practical for them to apply tin to some component terminations and tin-lead to others.
The result is that many of the components we buy will be available with only lead-free tin as a finish. My company pays component engineers to review each such case to assess the risk to our hardware, which I remind you, is used for military purposes and is expected to operate for decades without failure. Each such review is expensive. For equipment destined to operate in space, the use of tin without lead is strictly prohibited.
In each case where the determination is that we cannot take the risk, we are faced with the prospect of redesigning the equipment to get by without it (often not possible without serious performance consequences) or getting the terminations dipped in ordinary tin-lead solder (all the way to the body, with attendant risk of damage due to asymmetric heating). The US Navy recently spent a million dollars on a project to assess the risk of heat damage to tin-plated components that had to be solder dipped to render them usable by some of its programs.
One company has developed a business of replacing the lead-free tin plating on a certain type of component with tin-lead plating by a proprietary process. It should be obvious that had it not been for RoHS, these activities would be unneeded. The costs and risks of handling delicate components alone are significant, but for those applications where the components are needed to achieve performance requirements, there is no alternative.
Our risk of field failures due to the RoHS directive is greater than what I have discussed so far. In addition to building EEE we buy many electronic subassemblies. Where those subassemblies are commercial off-the-shelf, we have no control over what components get used or how rigorous a risk analysis has been conducted before a component is selected. The manufacturer can change the components used at any time without even notifying us.
In conclusion, I understand that your questionnaires are intended to be used to supply data for a cost-benefit analysis. Regrettably, the benefit part of that analysis was not done before the RoHS directive was enacted. I have read the preamble carefully, and while I see vague allusions to benefits, I can find no claim that can be verified with publicly available data. Instead of documenting actual cases of poisoning by lead (and the other prohibited substances) that have occurred due to use in electronics, the directive's authors seem simply to have assumed that their use poses risks to public health. The precautionary principle puts the burden of proof on those who seek a change from prevailing practices. In this case, burden falls on the people who have asserted that substances must be prohibited. They have failed to provide even rudimentary proof. Of course, if the proof doesn't exist because the assertions are false, that is understandable.
For what it is worth, my training is in chemistry, and starting in 1999 I have conducted extensive investigations into whether the risk is real or imagined. There's no question in my mind that it's the latter. In fact, you will have a hard time finding any scientist or engineer who has been involved in helping the industry adapt to the directive who believes that the risk is real. They do what they are told to do because their employers are told what they have to do, but their heart is not in it. That aspect may not emerge from your questionnaire explicitly, but if you look for it in the responses, you may detect expressions of an underlying hostility toward those responsible for enacting RoHS. Those scientists and engineers have job security, to be sure, but most would have preferred to be engaged in an activity with some redeeming social value.
Despite a rigorous search I have been able to find not a single case of poisoning attributed to use of any of the prohibited substances in electronics. Did you know that blood lead levels have been dropping for decades since lead was removed from gasoline and paint? Did you know that the major sources of cadmium in people are food and cigarettes? Or that the major source of mercury in people is the burning of coal for power? So if you find that the costs are real and the risks are not, the analysis you publish should make it clear (if your client will allow you to tell the truth) that RoHS has been not a boon to society but a burden.
Before I would be willing to recommend the use a sharp pencil to document the cost impact of the RoHS directive on our company in completing your questionnaire, I would want some assurance that someone was conducting a parallel and sincere effort to, for the first time, document the actual environmental and health consequences of the use of the prohibited substances in electronic equipment. Actually, if that effort were made, and the results showed that there is no credible harm from the use of the prohibited substances in EEE, there would be little need for people to spend time completing your questionnaire to document the costs. Without effort those costs can be seen to run into the billions.
]]>You must know something we don't to be so confident - please share.
I have not heard from the EU consultatnts on the result of exemption stakeholder consultation round 6 - do you have an inside track?
John
]]>I actually went to college with Jessica and graduated from the same major. I am trying to reconnect with old friends, so would greatly appreciate it if you could forward her my info..
Thanks!
Shalin Shah
shalinshah@gmail.com
Nothing, and I mean nothing, he states on here or anywhere else for that matter is fact, it's all fantasy and if you think about it, it's rather sad and pathetic. However, it's just plain tragic that good people are being swindled and mislead. You would think that there would be laws against that type of criminal behavior...oh wait! there are, it just takes people speaking out and reporting these incidents to the proper authorities to hopefully put people like him out of commission. And, for your sake, I hope that's just what you did.
I'm glad to see that people are speaking out about this person and letting others know that he's a predator, plain and simple.
]]>There are many good strong archers in the States but I don't think this bloke is one!
]]>An English Archer
]]>Simple answer, yes.
I am competing against product that is non RoHS compliant every day, especially from the American imports.
It appears to not be worth the paper it's written on.
There appears to be a misconception within our industry that it only applies to "newly designed" product, so existing designs are exempt.
]]>I like the cost calculator for determining the profit to be had by blancing SMT lines and would be greatful if yuo could send me a copy.
Thanks
Ian
]]>The idea that many people have of a big bow tends to be a 100lb draw weight, this is based generally on what they, as a modern man, can shoot. Many take this idea and transpose it onto the abilities of the medieval English military archer, then look for evidence to support that 'fact'. This can and does lead to false perceptions. The average draw weight of the Mary Rose warbows was 140lb and by that time the warbow was in serious delcine, it fact Henry VIII passed into law that no archer should practice at anything less than 220 yards when shooting at the marks. This distance of 220 yardswas based on the distances between the archery butts in 14th century, when archery was at its high point in England. That distance would need to be achieved with a heavy battle shaft (many people seem to forget the arrow in all of these debates), to shoot an arrow of appropriate size that distance requires an appropraite bow, in the region of 120lbs draw weight and above. The distance of 220 yards was the 'minimum' required distance with a battle shaft, the furthest distances at the Finsbury Marks were almost 400 yards! A competition has just been held in England to simulate such shooting. The 'Military Arrow' used simulates the English battle shaft, 32" long, hand forged hand, 8 1/2" fletches 1/2" high, horn re enforced nock and weighing 75grams. The furthest distance achieved was a huge 279 yards, the next 227 yrds, both of these bows were in the region of 140lb draw weight, bows in the region of 80-100lbs draw did not even make 200 yards.
The average hieght of a london resident in the late middle ages was 5' 8", hardly small and it has been shown that a farm labourer of the same period would consume about 5000calories per day of a very healthy diet.
There are very many archers in England shooting war bows in excess of 100lb draw weight, 140lb bows are becoming increasingly common. Those archers of old trained from childhood, they were fit, healthy (well the ones who didn't die of disease!), headstrong individuals, and they knew their bows.
Cheers all
Nick
]]>Sincerely,
Ellison
See link below (Same applies to: RoHS 2002/95/EC)
http://ec.europa.eu/environment/waste/pdf/faq_weee.pdf
Homogeneous material means a material that can not be mechanically disjointed into
different materials.
Definitions:
The term "homogeneous" means "of uniform composition throughout". Examples of
"homogeneous materials" are individual types of: plastics, ceramics, glass, metals, alloys,
paper, board, resins and coatings.
The term "mechanically disjointed" means that the materials can, in principle, be
separated by mechanical actions such as: unscrewing, cutting, crushing, grinding and
abrasive processes.
You should check your sources instead of just repeating bad information. Minnesota, Maine, Maryland, New Jersey, Tennessee, Vermont, Washington, and Wisconsin do not have RoHS-like legislation enacted. While they had legeslative bills debated last year, there is a big difference between bills and laws.
]]>I'm interested in your products; I'd like to ask about the RoHs status for the following part numbers
T-2-53012-S
TA-2-81219
and are they have an exemption?
I'll appreciate your feed back.
Thanks
Mohamed Shalaby
]]>I am of mixed feelings regarding a nationwide RoHS-like law.
On the one hand, yes, it would be much nicer to have one law to deal with, instead of the 50+ we would have if each U.S. state and non-state district or area write their own RoHS equivalents.
However, the 10th Amendment to the U.S. Constitution states "powers not delegated to the United States by the Constitution, nor prohibited by it to the states, are reserved to the states respectively, or to the people".
It is possible that a federal RoHS-like law could be written on the grounds of regulating inter-state commerce. It is also possible (and I think likely) that such a law will be caught between competing pressures from environmentalist groups and manufacturing groups, and will wind up being as dense & unintelligible as any other bit of recent federal law.
And in general I think it is a bad idea to advocate action by the federal government whenever two or more states take different approaches to the same topic.
So, as I said before, I am of mixed feelings regarding a U.S. Federal RoHS-like law. I dislike RoHS and WEEE in general, as they both have lofty ideals and poor implementation of those ideals, and I think a U.S. RoHS equivalent on a federal level could present an equal amount of needless disruption and paperwork. I hope the U.S. federal government keeps their hands out of this mess until further results are seen from Europe and California.
]]>Just thought you should all be aware.
]]>2) Which of the following factors do you think adds to the credibility
of this blog?
a. Design of the blog definitely adds to the credibility
b. Navigation of the blog somewhat adds to the credibility
c. Openness and transparency of the blogger no opinion
d. Writing style of the blogger somewhat adds to the credibility
e. Content of the blog definitely adds to the credibility
f. Interaction with blogger definitely adds to the credibility
g. Interaction with other blog readers definitely adds to the credibility
h. Frequency of posts definitely adds to the credibility (especially so with this ever changing topic)
i. How quickly the blogger responds to comments definitely adds to the credibility
j. The blogger's role at their company no opinion
k. The authority of the blogger definitely adds to the credibility
l. Anything else? His blog is fun to read and educational. A concept mastered by Walt Disney.
Please pick one or two factors, and tell me which factor you considered
added the most credibility for the blog, and if possible explain why?
Dr.Ron's status within the area, his education and his knowledge. He is a subject matter expert and is very helpful with his readers.
3) Has your impression of the blogger's company changed since reading
his/her blog? If so, in what why has your impressions changed?
I have not been involved with his company to date.
4) How would you describe the blogger's writing style, in individual
articles, the whole blog and in their comments?
Very easy to read....for the layman, interesting, talks about current and valid points.
Also, I am throwing in this quirky question:
5) If you met the blogger in the street, what would you know about
them, how would you describe them?
Not your typical nutty professor. Very down to earth, nice guy. Not aloof or standoffish
]]>Any thoughts? Thanks
]]>Please send a copy of your paper on lead free assembly.
We produce whisker resistant 100% pure tin plated wires for leaded components.
Thanks for the reference to Shimadzu in your conference notes. I have asked them for help on quanitative testing of electroplated wires to meet the 1000 ppm max Pb RoHS requirment. We are a little confused on whether tin plated wires are homogeneous or require separation to check for lead in just the thin tin plated layer. Can you help clear up our confusion?
Thank you very much.
Loren
]]>With regard to not getting hurt, anytime you stress a muscle more then 70% you must give it 4 to 5 days to recover. In a manor of speaking, when you are working out or other wise stressing your self you are tearing down tissue in order to build it up stronger. If you don't allow recovery time, you are only tearing down and never building up.
With reguard to world recods set for pulling bows, I believe that we are at the very begining. There are powerlifters that I suspect could pull drawweights upwards of 500 lbs if they put their minds to learning the technique. You can look at pictures in the following forum to get an idea of where the upper limits of humman strength have reached.
http://www.fortifiediron.com/invision/index.php?showforum=15
I have a webpage that will give you some of the basics to get started on pullinga heavy bow.
http://mysite.verizon.net/tsafa1/workout.htm
I have been a stregnth athlete for over 20 years and am able to draw very heavy poundages. My draw capabilites jumped up when I switched from a victorian style of shooting to medieval style. The victorian style pulls straight back using the rear deltoids. The most I can pull with this is 110. The medieval style requires you to lean forward, point the bow down and pull back in a circular motion using the larger latisimus dorsi muscles "lats". These are the same muscles you use when doing pullups. Not only are they big but they also have excellent leverage because of how the attach to the body in reference to the sholder joint. This is not an easy way to draw. It requires practice. I think of it as doing a one arm pull up into the bow.
]]> I love that you did this! I build bows for friends and usually recommend 45 to 60 lbs at draw length.
Hill taught us of course that anything short of the big bears could be taken with a 35 lb bow but I also favor bows in the 100+ range.
When why I use a needlessly heavy bow my easy response is "because I can". And so I shall continue as long as mind and body allow.
For the record although I am very comfortable in the 100 to 110 range and feel that any healthy male could attain this with practice it seems as though every pound after that is exponentially heavier then the last and cannot draw 120 smoothly enough to shoot. Would love your comments on crossing that threshold!
Sean
]]>I was amused by your story about trying to make a phone call and being charged for it exorbitantly. In this age of mobile wireless, and even free communication, I think that's ironic. And I wonder why hotels these days charge us for local calls. Shouldn't it be part of their service?
On to other things...thank you for giving me a glimpse of the good and bad sides of lead and lead-free. As a gadget user, it's good to know these things, too.
]]>Good Day!
Can I ask for a copy of your paper on Lead-Free assembly of 01005 passives?
I am a hardware design engineer in EAZIX Inc. and we are on the transition to Lead Free/RoHS.
I thought maybe your paper can give us more insights on the advantages for lead free and would be a great help along the way.
Thanks
Ryan
]]>http://mysite.verizon.net/tsafa1/longbow/06-09-06_0107.jpg
It invloves pulling a 100 lb cable to the ear, holding it there for 10 seconds, then doing 10 quick reps an then holding it for another 10 seconds in the same form that I use to draw my bow. I do 4 sets like that, each arm. The offhand is on the poll in front of my keeping me from flying into the poll, so there is 100 lbs of presure on my shoulder and tricept. The angle of the cable is slightly off, but it still concentrates the rear deltoid muscle.
You will notice that the rack is 200 lbs but the leverage of this pully brings the actual weight pulled to 100 lbs as I have measured. The nice thing about such an excercis you can selct a weigth that is right for you and build up from there.
It is my firm belief that you can not achieve your true strength potential in anyone area unless your whole body is close to that level. You can not strenthen your upper body unless you also strengthen you lower body. Doing heavy squats, benches and rows stresses the whole body in such a way that it increases the rate of metabolic reactions. It also increases your bodies testosterone output. When you go to work your rear deltoid you will impact it more greatly with increased metabolic and testosterone levels.
Apart from this there some technique involved to asist in pulling a heavy longbow. Rather then stand straight and pull back straight to the ear, it is helpful to lean forward and pull back in a circular motion to the ear as you stand upright. This utilizes the lower stronger Latisimus Dorsi muscles "lats". In standing upright you then transfer power to the upper back and release. Esentialy you are doing a pullup into the bow. Infact doing pullups and lat pulldowns in the gym will strengthen you further for this technique.
]]>The article in full is at the above link.
]]>I am curious as to youir opinion Dr. Ron on the experiments and procedures.
]]>Although a truly meaningful tin whisker test will only arise once the actual mechanism for whisker initiation/growth is understood, appropriate acceleration factors are selected and confirmation is achieved. The tin whisker testing methodologies developed thus far use traditional environmental stresses such as elevated temperature, elevated humidity and thermal cycling between temperature extremes.
Tin whiskering performance of a particular finish is known to depend strongly on a variety of factors, including surface oxide condition, electrodeposit thicknesses, composition of the barrier layer, level of residual stress, temperature and time.
The military and aerospace industries have also examined tin on nickel along with other combinations that are much more expensive. Typically, nickel barrier layers in the neighborhood of 1-3 um are thick enough to block interdiffusion but not thick enough to make the interfaces brittle. 12-15 um of tin on 600-800 um of nickel has successfully hindered tin whisker growth.
Many studies have examined specific electrodeposited finishes within controlled experiments using the above mentioned testing methodologies. Within the constraints of the aging conditions, plating chemistries and sample types utilized for studies, several conclusions can be reached. For pure tin electrodeposits, nickel barrier layers were significantly more effective than copper barrier layers in the suppression of whiskering. Matte tin and bright tin over nickel barrier layers did not whisker when subjected to the various environmental aging conditions in several studies. If nickel barriers are as effective as several prominent studies would indicate, the industry may indeed have a solution to the tin whisker problem
]]>Contemporary accounts do not support the notion that longbows shot "nuclear arrows" that could defeat any plate armour. See accounts of Brouwershaven, Flodden, and others.
I wonder, are you familiar with the research of Dr. Alan Williams' "The Knight and the Blast Furnace?" The chapter of his book on armour penetration (as well as the appendix on "the target" from Robert Hardy'd "Longbow") demonstrates that, while an arrown fired from a longbow might pierce the thinner armour on the limbs, it was unlikely to pierce the thicker armour on the torso or head to a depth sufficient to seriously injure or kill the armour's wearer.
]]>What's the big deal? How would you like to be at 40,000 feet when a critical system fails on that 747? You say I'm crying wolf? Great. you can be first in line at the gate. Enjoy your flight.
]]>I am happy to see I am not the only person attemping to pull extreme weights , I hope your shoulder heals up as soon as possible .
As far as the World title , Sorry Mark Stretton , thats Mine ,You too will soon say
" Den Erickson is The Worlds Strongest Archer "
Don't worry though , you are a close second , but second is not the Strongest is it ?
]]>Another interesting item. Many I have spoken with are now just counting China out of their sales plans due to more strict RoHS rules. From what I am being told, it is not economically feasable to sell into China given the method in which China will test all products.
]]>As to Stats
I am 5'8" , and 280 lbs . 32 years of age
In coorespondance with Pip he has mentioned he does not endorse any one let alone Mark Stretton pulling such heavy weight as he feels it is historically inaccurate .
This is for informational purposes as well as serving as a challenge to Mark Stretton to Match me or beat me as The Worlds Strongest .
I may be reached at Varbogen@aol.com
or USA tel 262-705-2245 .
Sincerely ,
Den Erickson
The Worlds Strongest Archer ( U.S.)
The theme "mixed alloys reflowing" is particularly important for in-development countries, because we are forced to work with Pb-free parts (including BGA), due to market availability, although having not directives like RoHS. In fact, today this is a "fashion" issue, and open opportunities for thousands of consultants in electronic boards assembling companies. Opinions from experts like you are very appreciated for us, giving us references for planning the right time to change to fully Pb-Free reflowing process. Please, ever help us!
]]>An interesting item, we got a certificate from one of our manuafcturing facilities showing they were approved via a facilities audit showing they used RoHS approved methods and procedures in the assembly process of their finished goods. I think this is a great idea.
Based on what I have seen thus far, the majority of folks are just compiling CoC's and getting documentation to show the products are RoHS compliant. From what I have read and heard, this will not be enough to show due diligence. I believe that once some enforcement and punishment has been dished out, more folks will do more things to show compliance. Right now, there is no bite behind the EU's bark when it comes to RoHS....or very little. People will only do what they have to do until they see otherwise.
Personally, I was thinking people were going to do BOM scrubs at a minimum as well. I even considered buying an application and offerinfg the service after I saw what other places were charging for scrubs (minimum $2500 or $10 per line-item). I sent out notices and feelers with little, almost no response. If it were my name on the product, I sure as heck wouldn't trust a certificate on everything. All it would take is once to get burned.
]]>Lisa Cassinari
HR Consultant/Recruiter
Millstream Associates
Got this from them:
The aim of the Cadmium regulation law environment dangerous substances are among others keeping out Cadmium Keeping products on the territory of the Netherlands independent of the European Economic Area (HONOUR). THE HONOUR exists from the territories of the EU-member states, the kingdom Norway, the republic Iceland and frost kingdom Liechtenstein. This means that goods which have not been brought nevertheless on for this the mean territory in consumption environment can be brought. The ministry of VROM sees to this end on. This supervision was exercised on the basis of decision indication
supervisory civil servants VROM-regulation (Stcrt of 20 December 2001,no. 247/ page. 27).
V.w.b. the product Cadmium refers I you to the ministry of V.R.O.M. On the Internet site of V.R.O.M., www.vrom.nl/pagina.html?id=9186, more
information is consult concerning cadmium.
The address of the ministry of V.R.O.M.: PO Box 16191, 2500 BD Den Haag.
YOU can conjugate visibility for further questions also at the aforementioned ministry of V.R.O.M. or with the VROM inspection, LMIP of V.R.O.M.
I am sure you will enjoy reading it.
]]>A little input would be appreciated.
Ted
]]>For Cr(VI) a cheaper (and more readily accepted method) is a colorometric method using a UV-vis spectrometer. Even a little $1K unit will work, although the one we bought costs about $8K.
Bev
RIM
Swatch was apply for an exemption, may I ask what is the newest situation? Does the company succeed and go back to lead solder? Where can I find more information about this?
Your reply would be truly appreciated. Thanks a lot.
]]>At this point, several industrial clients of mine are insisting on non-RoHS assembly (RoHS parts are OK, just not the assembly process) of all componentry used on assembly equipment and control systems.
And by the way, my new Moto phone died in 6 weeks, and has been replaced twice and I'm wondering how long the third unit will last.
RoHS just isn't a good idea, and point me to the sign-up sheet to start the revolt...
-John Anderson, Professional Electrical Engineer
]]>best regards,
M.Saeedi
the cited study doesn't compare SnPb finish to LF finish, it compares different processing of components with LF finish.
Regarding (Motorola) cell phones: ours are all pre-2001 and shall last some more years. Cell phones are usually not operated at elevated temperatures. BTW: did you know that most Freescale (formerly Motorola) ICs were available with LF not before 2005? They seem to have different strategies for industrial and (greenwashed, SCNR) consumer products.
Given that you are "surrounded by electronics that are all < 3 years old" it's indeed unlikely that you will "ever be a victim of a reliability fail due to RoHS compliant (read lead-free) assembly". BTW: my 8 year old notebook PC runs still with the first HDD. Our ten years old PBX and telephones don't lack any feature and won't be replaced in the near future - to be continued...
Oliver
]]>