It was great to go through your post. Keep up the good work.

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Mario,

I have an Immersion Silver PCB that the customer wants to use a LEAD process on. I am objecting to this as the surface finish melting point is higher than the Indium 6.3. Am I not correct in trying to steer the customer to a LEAD FREE process? What are the disadvatages of a LEAD process on an Immersion Silver surface finish?

Thanks,

Darren Dyal
Dallas, Texas

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Where can I get the files about the head in pillow? I spent a long time to find something on this web. But I can find nothing? Could you please advise where can I get the documents?

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We’re all proud of you, and the team, Mario.
THANK YOU!

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Thank you for your interest in my blog. Halogen-free solder paste is an important topic in the world of electronics. Unfortunately, we are not able to share the IPC’s documents, as they are copyrighted. You can download them from the IPC.org website.

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I am so lucky to look at you bolg for halogen solder paste.I concern with the test for halogen F,cl,Br,I in solder paste ,as being a QA in our company.with you kind to support me the document- IPC J-STD 004B mentioned above for hagogen for me.
my email :gl.chen@cti-cert.com
thank you beforehand.

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Very interesting Mario, it’s a good help as troubleshooting inclusive
Well done!

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What is the best connector to use to connect individual solar cells?? Does Indium corporation sells bypass diodes??

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Mario,

We are about to start using a 3mm x 3mm QFN. The pad size is .2mm x .25mm with a thermal pad. We are currently using NC-SMQ92J with mesh size -325/+500. Should we change to the -400/+635 mesh. This product will also have QFP’s/BGA’s/Transformers/Inductors, etc.

We currently use Laser cut w/Electropolish stencils at 5mils.

Thanks for your help.

Regards,
Joe

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Excellent presentation! Help me a lot, thank you Mario.

Well, my torture is your benefit… :)

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Congrats Mario,
Grateful to see your Blog. We are expecting more “experience sharing”. Best Wishes!

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