Great idea Daryle, check out tomorrows entry for a proper reply!

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“If your still looking for that elusive data sheet that answers a general question…”

Sounds like you’re offering an alternative to the “Easy” button found at Staples. Of course we’re talking about application notes here and not buttons but the notion itself is still intriguing.

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This is the very end of an essay I recieved recently: ...So, in summary, the creators of Spam must be credited with the ideas of hermetically sealing to maintain freshness and durability to withstand the dangers that every can of Spam may encounter in an emergency situation. Obviously, as with the semiconductor field, packaging can be extremely important to the effect of the overall end product.

I hear you have prizes : )

- Bob B.

(Bob is local, he will be stopping by to pick up his prize – although he is far too excited about this…)

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Cheesy, but I like it…

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Spam officially means “spiced ham” however I would argue that Spam = a simple packaged meat.

This is much like our S.P.A.M = Semiconductor Packaging Materials. Both are fantastic packaged materials.

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Hi Liya,
That’s a good question. My experience is in ball attach fluxes and wafer fluxes, so that is what I am referring to, not flux vehicle or paste for SMT – although I am sure the same design principle is used.
~Jim

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Jim, are you reffreing to SMT fluxes too? Indium3.2, Q65, 6.2/6.3?

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Hi Mickael,
This is very common indeed. The magic number is 350 for processing Au/Sn – here’s why: Below 350degC you should use a flux. Tacky fluxes are best for holding the spheres in place. TacFlux 007 is used most for this operation. Above 350degC a flux will not work, that’s the point where you want to reflow the spheres in a forming gas atmosphere. You wouldn’t use a forming gas atmosphere at lower temperatures because it starts full activation at ~350degC. I hope this helps!

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Do you have more details or information of AuSn spheres soldered on Ni surface. Thks

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Nice work for a tourist! Seriously, good job as you gave me an idea! Bill.

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Awesome idea, Jim. So, I stole it!
You are always out in front.

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Hello Dave,
That’s a great question – it’s worthy of much more than a brief comment! I look foward to posting an entry devoted to solder joint reliability within the week if possible. If you are patient enough to wait – that’s fine, but you can always reach me at (315)853-4900 ×7592 to chat about this or any other topic.
All the best,
~Jim

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I would like to more about the process variables and how they effect the reliability of the solder joint. Thanks
V/R
Dave

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The Asimo Robot is pretty amazing as well, thanks for sharing that with us Hu Di!

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Hi, Jim

I think you are may interested in Asimo Robot:)

http://world.honda.com/HDTV/ASIMO/New-ASIMO-run-6kmh/

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Wow! I have never heard of this – and hadn’t imagined robotics to have advanced this far (revealing my ignorance).

These capabilities indicate a HUGE amount of potential. Imagine using a fleet of these to carry injured people out of a danger zone, or to transport items into a hazard area – or an area that can’t support life.

I’d love to see a fun competition amongst a team of Big Dogs. That would be cool.

I can envision a Will Smith movie where a helicopter drops twenty of these things into a danger zone and they dart in different directions, dropping cameras, snares, supplies, etc. to catch the bad guys and support the good guys. Cool!

I wonder where these will see first use (or have they already???). Imagine being a terrorist sitting on a rock somewhere, watching one approaching. That would be a moment! Thanks for enlightening me.

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WOW! And I thought AIBO was creepy!

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A lot of camera phones have LEDs built in for flash already. I have the luck (or curse?) of having a Windows Mobile based phone, where I can get a program to turn on the flash. It is also possible to do from the camera application. Bright enough to walk around in a dark room at night! So get yourself an up to date phone and hack away ;)

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That is one of the best ideas I’ve heard in a long time!!! I use my cell as a flashlight all the time, but its HARD to find my way across my bedroom in the middle of the night with just the glow from the tiny screen.

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Thanks mate! I wonder why it didn’t catch on with other models?

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Mobile with torch light – i know nokia have done some phones with them !!!

http://www.mobile-phones-uk.org.uk/nokia-1100.htm

Also Nokia 5140 and 3200 have torches…i think there may even be more:o)

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Thank you – that means a lot coming from my blog guru!

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I delcare this the coolest Indium Corporation blog posting of Q1 2008.
Awesome!

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Thanks for the interest!
The particle size for Au/Sn paste is dictated by the customer. Common applications use type 3 (25-45 micron), type 4, type 5, and type 6 (5-15 micron) powder sizes.

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I want to know the Au-Sn paste Particle size.

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I want to know the u-Sn paste Particle size.

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Thank you Gulf, I appreciate your interest and support!

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Hi Buddy,
You did much research on these advanced material application, and share with us, thanks for your great job.

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Thanks Jeff,
It really is amazing that the semiconductor packaging industry (in general) doesn’t bother to measure flux deposits – yet.

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Jim: Nice imagery of the printed flux deposits. I think our industry is somewhat deficient in the knowledge presently available on evaluation of flux deposition processes based on quantitative evaluation of discrete deposits. There is another company I have seen recently advertise flux deposit inspection capability, Cyber Technologies. It will be interesting to see if the industry responds by adopting these “new” tools to provide us greater detail on flux deposition process control.

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