Reflow, Solderability, and Voiding of BiAgX®
BiAgX® Reflow Mechanism
BiAgX® Ideal Reflow Profile
Best Practice Profile Guidance
|Initial ramp to 140°C||1.2 - 1.8||°C/s|
|Ramp 140 - 262°C||2.4 - 3.0||°C/s|
|Time above 262°C||25 - 35||seconds (s)|
|Peak temperature||320 - 330||°C|
|Initial cooling rate||8 - 10||°C/s|
Taken from "Lead-free Solder Attach for 200°C Applications" -
Johnson et al., iMAPS HiTen Conference, Oxford UK, July 2013
Related Markets and Applications
Top BiAgX® Technical Documents
Reliability of BiAgX® Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications (Paper)
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System (Paper)
SMTAnews Journal April-June 2013 (Other)
BiAgX® Presentation, 2015 (Presentation)
BiAgX® Technical Documents
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Product Data Sheets
Safety Data Sheets
BiAgX® Blog Posts
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical...
I'm just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don't realize is that the NC-SMQ75 solder paste can be used as a no-clean material...
Folks, An obvious disadvantage of lead-free electronics soldering assembly is that the oven must be hotter and therefore will use more electricity (versus 63Sn37Pb soldering). But is the extra amount of electricity significant? Bill O'Leary claims...
Dr Ning-Cheng Lee (Indium Corporation's Vice-President of Technology) just let me review his team's excellent upcoming paper on solder technology for high temperature Pb-free (lead-free) [HTLF] applications, such as Power Semiconductor die-attach. Dr Lee...
From One Engineer to Another®
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