Customer Survey

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* First Name:
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These are my Pb-Free Needs (check all that apply):

General Requirements:
	Air-reflow, no-clean, Pb-free solder paste.
	Pb-Free solder paste that performs like a SnPb solder paste.
Performance Requirements:
	Long stencil life: to enable long production runs.
	Excellent print-transfer properties: Designed for fine-pitch CSP assembly: 0201 and 01005 technology.
	Consistent print volumes: Designed to print through apertures below the industry recommended minimum area ratio of 0.66.
	Excellent response to pause: to optimize production line operational efficiencies.
	High component retention tack strength: to reduce component shifting defects.
	A robust reflow process window: Accommodating high peak temperatures and long soak profiles.
	Elimination of “head-in-pillow” defects when mounting BGA devices.
	Low-voiding properties: <5% voiding when soldering BGAs with via-in-pad technology.
	Excellent test probeability: with thermally stable, soft, pliable post-reflow residues so I receive fewer false rejects during in-circuit testing.
Overall Goals:
	Increase finished goods reliability.
	Increase finished goods first-pass yield.
	Increase manufacturing process efficiencies.
	Reduce average process cycle time by reducing downtime.
	Reduce total cost of usage.
	Reduce process scrap.
	Enhance finished goods performance.
	Increase operational profitability.