Indium8.9
Product Information
In Circuit Probe Testing
Ultra Fine Pitch Printing
Response-to-Pause Procedure
Void Characterization
IPC/J-STD-004A Product Level Testing
IPC/J-STD-005 Test Results
Compatibility
Take the 30-second survey: Tell us what YOU need in a Pb-Free Solder Paste
Return to Main Page
Customer Survey
*
Required Field
*
First Name:
*
Family Name:
*
Company Name:
*
City:
*
Email Address:
These are my Pb-Free Needs (check all that apply):
General Requirements:
Air-reflow, no-clean, Pb-free solder paste.
Pb-Free solder paste that performs like a SnPb solder paste.
Performance Requirements:
Long stencil life: to enable long production runs.
Excellent print-transfer properties: Designed for fine-pitch CSP assembly: 0201 and 01005 technology.
Consistent print volumes: Designed to print through apertures below the industry recommended minimum area ratio of 0.66.
Excellent response to pause: to optimize production line operational efficiencies.
High component retention tack strength: to reduce component shifting defects.
A robust reflow process window: Accommodating high peak temperatures and long soak profiles.
Elimination of “head-in-pillow” defects when mounting BGA devices.
Low-voiding properties: <5% voiding when soldering BGAs with via-in-pad technology.
Excellent test probeability: with thermally stable, soft, pliable post-reflow residues so I receive fewer false rejects during in-circuit testing.
Overall Goals:
Increase finished goods reliability.
Increase finished goods first-pass yield.
Increase manufacturing process efficiencies.
Reduce average process cycle time by reducing downtime.
Reduce total cost of usage.
Reduce process scrap.
Enhance finished goods performance.
Increase operational profitability.
