Technical Support Engineer for PCB Assembly Materials
Phone: +1 (315) 853-4900
Address: 34 Robinson Rd., Clinton, NY USA 13323
Brook is a Technical Support Engineer for PCB Assembly Materials in Indium Corporation’s Solder Products Business Unit. She acts as a technical liaison between our customers and internal departments, such as R&D and production, to insure the best quality and selection of products. She also provides support in improving informational materials to assist PCB assembly materials customers.
Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in Chemical Engineering (with a focus on materials) and German Language. While at URI, Brook worked as a research assistant in the Sensors and Surface Technology partnership, doing research on metallized thin polymer films for IR imaging applications. She also spent a year in Germany studying at the Technical University of Braunschweig and completing an internship focusing on thermo-analytical analysis.
Brook previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.
Brook Sandy-Smith's Technical Documents
Brook Sandy-Smith's Blog Posts
SMTA Empire's Expo and Tech Forum on June 15, 2017, in Syracuse, New York.
Brook Sandy-Smith will be moderating the Bottom Termination Components Design Panel at ICSR 2017.
This video is for people weighing the use of no clean versus water-soluble solder paste formulation. It discusses examples of the need for cleaning, includes recommendations for water soluble and no-clean solder paste....
From One Engineer to Another®
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