circuit board

Christopher Nash

Christopher Nash

Product Manager PCB Assembly Materials

Indium Corporation
Phone: +1 (315) 853-4900 x7521
Mobile: +1 (315) 842-6665
E-mail: cnash@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

  • Certifications:
  • SMTA
  • IPC
  • 6 Sigma Green Belt

Blog

Christopher Nash's Blog

Biography

Chris is the Product Manager for Indium Corporation’s PCB Assembly Materials. With an intimate understanding of customer needs and challenges, he works closely with Indium Corporation’s R&D team to deliver fully scaled, launched, marketable product solutions for PCB Assembly solder pastes and epoxy-based products. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.

Chris joined Indium Corporation in 2005. He has authored numerous process and technical guidelines and has presented at numerous industry forums and conferences.  He is a member of the SMTA and participates in the occasional IPC standards development committee.

Chris has bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green-Belt from Dartmouth College’s Thayer School of Engineering and has earned his certification as an SMTA Process Engineer. 

Christopher Nash's Technical Documents

Christopher Nash's Blog Posts

Tips for Successfully Using Vacuum Reflow Ovens in SMT Soldering

24 Jan 2018 by Christopher Nash [view bio]

Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow.  Here's how to achieve the best results possible.

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design

26 Apr 2016 by Christopher Nash [view bio]

Learn about the many factors associated with BTC voiding reduction.

 

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile

26 Apr 2016 by Christopher Nash [view bio]

In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.  This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have.  This particular Ishikawa Diagram displayed that reflow profile can have a large effect on voiding.  Today I will dig into this area a bit further and talk about how we can minimize large ground plane solder voiding in electronic assemblywith differences in reflow profile.

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