SPIE Photonics West 2023!
Indium Corporation to promote new specialty product offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...
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Minimizing Graping
Folks, This post is an excerpt on graping, from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Intr...
Shots
Shots provide a larger area-to-volume ratio for the metals and alloys that favor the interaction with external elements. Engineers using smaller melt ...
Stuck in a Slump? Factors Impacting Solder Paste Slump Susceptibility.
Certain solder pastes are more susceptible to experiencing slump than others due to both chemical properties and experimentation processes. Risk facto...
Join Me at SMTA Pan Pacific 2023 to Learn about the Twin Paradox
Folks, Although my PhD is in materials science, my BS was in engineering physics. While getting my BS, I studied Einstein’s special theory of re...
Which Off-Eutectic AuSn Alloy Do I Use?
Plating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints...
Finding Common Ground: Gecko Feet and the Heat-Spring
You have no doubt come across a sticky-stretchy figure that you throw against a wall and it slowly slinks down to the floor. There is a common misconc...
Have You Been Keeping up with The Adventures of Maggie Benson?
Folks, Two of the workers at Ivy-Benson electronics just got engaged and they are on their way to a factory in Mexico to see if their boss Maggie Bens...
Minimizing Tombstoning
Folks, This post is an excerpt from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introduction: Printed...