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Corrosion - Part 4, Learn More

Category:
  • Tin Lead
  • Thin Film
  • Semiconductor Packaging
  • Indium Corporation
  • Here is a pretty good list of resources on the topic of corrosion, if you’re interested:

    1. Chongchen Xu. “Corrosion in Microelectronics“ 2003
    2. Charles A. Harper. Electronic Packaging and Interconnection Handbook. Third
    Edition. McGRAW-HILL, 2000.
    3. Electronic materials handbook, vol.1, ASM international, 1989.
    4. A.J. Griffin, S.E. Hernandez and F.R. Brotzen. “A galvanic series for thin-film
    metallizations and barrier layers commonly used in the microelectronics
    industry”, Journal of electrochemistry society, 141(3), 807-809 (1994).
    5. Deny A. Jones. “Principles and prevention of corrosion”. Prentice Hall, Upper
    Saddle River, second edition, 1996.
    6. W.M. Paulson and R.P. Lorigan. “The effect of impurities on the corrosion of
    aluminum metallization”, Proceedings of the IEEE Reliability Physics
    Symposium, IEEE, 42-47 (1976).
    7. Andrew H. Rawwicz. “Stress induced corrosion of wire micro-joints in
    microelectronics – a quantitative model”, Microelectronics and Reliability, 34(5)
    875-882 (1994).
    8. M. Hansen and K. Anderko. Constitution of binary alloys. Mcgraw-Hill, 1958. 22
    9. W.W.Binger, E.H. Hollingsworth and D.O. Sprowls. Aluminum, vol.1, American
    Society of Metals, 1967.
    10. Simon Thomas and Howard M. Berg. “Micro-corrosion of Al-Au bonding pads”,
    IEEE transactions on components, hybrids and manufacturing technology, 10(2),
    252-257(1987).
    11. Joseph Fauty, Steve Strouse, Jay Yoder, Carlos Acuna, and Phil Evard. “Al-Cu
    metal bond pad corrosion during wafer saw”, The International Journal of
    Microcircuits and Electronic Packaging, 24(1), 19-29(2001).
    12. Fu-gin Chen and A. Jean Osteraas. “Electrochemical dendrite formation during
    corrosion of connector leads”, Proceedings of ASM’s third conference on
    electronic packaging: materials and processes and corrosion in microelectronics,
    175-179(1987).
    13. Kim A. Berry. “Corrosion resistance of military microelectronics packages at the
    lead-glass interface”, Proceedings of ASM’s third conference on electronic
    packaging: materials and processes and corrosion in microelectronics, 55-61(1987).
    14. M.J. Elkind and H.E. Hughes. “Prevention of Stress-Corrosion failure in ironnick-
    cobalt alloy semiconductor device leads”, Proceedings of Failure in
    Electronics Symposium, 5, 477-495 (1966).
    15. K.W. Rosengarth. “Corrosion Protection for semiconductor packaging”, Solid
    State Technology, 27, 1991-196 (1984).
    16. Vlasta Brusic, Doreen D. Dimilia and Robert D. Maclnnes. “Corrosion of lead, tin
    and their alloys”, Proceedings of ASM International 3rd electronic materials and
    processing, 261-268(1990).
    17. Michel Pecht. “A model for moisture induced corrosion failures in
    microelectronic packages”, IEEE transactions on components, hybrids and
    manufacturing technology, 13(2), 383-389(1990).