Why QuickSinter®? Let’s see the difference between Soldering and Sintering
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking...
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking...
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
Exploring the many benefits of InForm® soldering technology....
“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding....
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high...
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....