Semiconductor Pictorial Roadmap: Semicon West 2012
One of the things that bring customers over to our semiconductor tradeshow booths, year after year, is the pictorial roadmap. This is the diagram ...
Indium-Lead (In/Pb) Solder Alloys for Reliable Gold Interconnects in Semiconductor Assembly
Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (I...
iMAPS Automotive - Dearborn, Michigan: May 22-23, 2012
The iMAPS Automotive 2012 steering committee would like to invite you to participate in the 2012 conference (May 22-23, 2012) to be held in Dearborn, ...
Central New York — Waiting in the Wings for Semiconductor Assembly?
The following appeared in a slightly different form as an editorial in Chip Scale Review magazine’s online edition. ============================...
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time... As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I w...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...
Solder Powder: IPC "Type" and Surface Area
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voi...
Colored Fluxes: Not Child's-Play
One of the first activities any child enjoys, once they can manipulate things, is using paints and crayons to color pictures. Stay with me: ...
High Melting Pb-free Solder Paste
Dr Ning-Cheng Lee (Indium Corporation‘s Vice-President of Technology) just let me review his team’s excellent upcoming paper on solde...
Tin/Silver Solder Paste in Die Attach (Sn/Ag)
A customer at Semicon West this year asked about Pb-free solder usage in die-attach applications. Although many smaller discrete components ...
Indium Corporation at Semicon West 2011
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about ...
Thermocompression Bonding for Microbump Flip-Chip Soldering
For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D jo...