Indium Corporation's VP of Technology, Ning-Cheng Lee, Ph.D and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will both be presenting courses on Pb-Free electronic assembly at APEX in Anaheim, CA in February.
Dr. Lee will be presenting "Lead-Free Soldering - Metallurgical Fundamentals, Reflow Applications and Challenges" on Monday, Feb. 21, 2005 from 8:30 a.m. - 4:30 p.m. Dr. Lee is a world-renown soldering expert and also has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
His course will cover all the fundamental design considerations of Pb-Free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be discussed, along with major challenges, with a focus on metallurgical causes.
Dr. Lasky's topic is "Best Practices in Implementing Lead-Free Assembly" and he will also be presenting on Monday, February 21 from 8:30 a.m. - 4:30 p.m. Dr. Lasky, a holder of the prestigious SMTA Founder's Award, is a world-renowned process expert and visiting professor at Dartmouth College. He has over 20 years of experience in electronic and optoelectronic packaging and assembly.
His course will focus on all the "how to's" of implementing Pb-Free. It covers every issue, such as PCB finishes, components, alloys and SMT processes. It also reviews several actual implementations of Pb-Free processing and will conclude with a Pb-Free implementation plan to be used by July 1, 2006.