Package-on-Package Transport (4/5)
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Folks, My colleagues at Indium Corp tell me that some major companies are now starting to specify maximum halogen levels in solder paste flux residues...
Bucket Man is probably my favorite drummer of all time. He puts on a great show, he’s a down-to-earth guy, and he uses what he has around him......
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if......
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on th...
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...
We received a call today from a customer that had tested the halide content of their board and reflowed solder paste, without components, using Ion Ch...