IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Today we focus on Derrick Herron – one of the newest members of Indium Corporation’s Technical Services team. While new to tech servi...
Solder seems pretty simple, and, honestly, it doesn’t always need to be overly technical. But, many SMT, semiconductor, thermal management, and ...
NanoFoil® is especially well-suited for bonding LED packages. Here are some characteristics of the NanoBond® Process that fit high v...
The current version of IPC J-STD-004 is revision B, often referred to as J-STD-004B. Interestingly, all previous revisions remain useable. Let’s...
I’m still searching for the best use of NanoFoil®. Our customers have used it for LED and CPV die-attachment, sputtering target bonding, bat...
We have all seen the action movies where the hero drops in at the last minute to save the day against insurmountable odds. NanoFoil® is like...
Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux...
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or co...
Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, bu...