Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing appl...
It’s always good to be cautious when dealing with high-reliability devices. No-clean ball attach and package-on-package fluxes are usually desig...
After finding a batch of Package-on-Package components with a ~20% defect rate (that’s not a typo), I asked the vendor to have the lot of compon...
Today I was able to attend a professional development course related to Package-on-Package technology and trends. While the session was very informat...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...