SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, t...
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...
Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
Folks, In the nearly ten years that I have been blogging, I am continually surprised by the interest in a spreadsheet I created that calculates alloy ...
Overcoming the challenges we face in a production environment is accomplished in many ways. Ideas may be generated during a high-level brainstorming e...
Folks, Let’s look at Patty’s last day of class…... As she was driving north to teach her statistics class, Patty was sad to see her...
Round solder wire, especially flux-cored, has been a mainstay of the electronics industry ever since electronics came into existence. Round solde...
Folks, Let’s check in on how Patty is doing at Ivy U. Patty was nearing the end of her teaching stint at Ivy U. Only a few more classes re...
The telecom industry relies heavily on Telcordia (Bellcore) testing to determine the electrical reliability of no-clean solder flux residues. There ar...