Undiscovered: The Best New Use Of NanoFoil®
I’m still searching for the best use of NanoFoil®. Our customers have used it for LED and CPV die-attachment, sputtering target bonding, bat...
I’m still searching for the best use of NanoFoil®. Our customers have used it for LED and CPV die-attachment, sputtering target bonding, bat...
The 5th Concentrated Photovoltaic Summit is being held in San Jose, California again this year. This is an interesting show because it is focused only...
As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering...
This month’s nanotechnology post comes from the Electronic Privacy Information Center. Today I thought I’d share one of the most personall...
We have all seen the action movies where the hero drops in at the last minute to save the day against insurmountable odds. NanoFoil® is like...
At the SVC (Society of Vacuum Coaters) conference this year, I spoke about setting a “zero stress” temperature during target bonding. I&rs...
An important quote from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures is: “This suggests that a target bonded at one...
If you’re looking to catch up on the latest developments in CPV here’s a free event in which you can take part from the comfort of your of...
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Coefficient of Thermal Expansion (CTE) differences between materials can really cause problems when those materials are rigidly bonded. If you’v...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...