Greg Evans (President of Indium Corp.) on Customers, Change, and Technology
Jim: Greg, as a pioneer in Surface Mount Technology (SMT), you’ve seen many changes in......
Jim: Greg, as a pioneer in Surface Mount Technology (SMT), you’ve seen many changes in......
Materials to be used in packaging of high power semiconductor devices are often chosen by their coefficient of thermal expansion, or CTE. For ins...
I polled some of our field sales force to find out what common questions customers ask them. You (the reader) probably have similar questions.&n...
Ignoring the solder selection as part of your design process is risky business. font face="Times......
In this report by the National Renewable Energy Laboratory (NREL), ITO (indium tin oxide) is proven to be more resistant to m...
From an upcoming SMTAI presentation dealing with PoP solder paste: “...Formulation, particle size,......
Tim Jensen, PCBA Product Manager, Indium Corporation 作者:余敏 随着欧盟RoHSspan......
We’ve had some questions about using liquid metal or indium alloys liquid at room temperature containing indium and gallium, and the...