My Indium colleagues Dr. Andy Mackie, Jim Hisert and Adrian Low published a nice overview article on Solder Use in Chip Packaging. The article covers topics such as solder types and selection, bumping, soft errors, DCA, solder spheres, soldering with nano particles and much more. Check it out here. It is on page 49-52 in the November-December 2007 issue.
Cheers, and the best in the New Year!