3 weeks ago I had the chance to present at the SMTAI event in San Jose. This venue not only had pleasant weather, it had top level engineers that were hungry for more information on PoP, Head in Pillow, and BGA reliability. Man, that’s where a tech-guy wants to be!
Our team ended up presenting 7 papers at the event. The paper I was responsible for is titled “Next Generation PoP Pastes for Electronics Assembly”, you can download it here.
Please let me know what you think - questions or comments.
Thanks for getting this picture Bob!