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Redistribution Layers

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  • Indium Corporation
  • Acronyms can be confusing, especial acronyms which have many meanings – the popular ones not being what we are looking for.  The last time I checked, Wikipedia didn’t have an entry for RDL or “redistribution layer” that fits our industry. 

     

     

     

     

     

    As a simple explanation, a redistribution layer (RDL) is a set of traces built up on a wafer’s active surface to re-route the bond pads.  This is done to increase the spacing between each interconnection.  This build up is a wafer-level packaging step, a way of doing some of the device packaging before die singulation.  This saves money and makes processing quicker and easier.  If you are interested in this topic, I recommend checking out this article:

     

     

    Redistribution Layers by George A. Riley, PhD (FlipChips Dot Com)