Indium Corporation - Mailchimp

Semiconductor Packaging Materials - Find What You're Looking For

 
  • Are you looking for information on semiconductor packaging materials?  Send your request to jhisert@indium.com.  It’s all fair game – released, experimental, or competitor materials.  Flux characteristics, paste properties, application methods…

     

     

     

     

     

    Inquire about any of the following topics:

     

     

    • Pin transfer

       

    • Package-on-Package (PoP)

       

    • Solder spheres

       

    • Glass transition temperatures (Tg)

       

    • Flip chip assembly

       

    • BGA rework

       

    • Cross-sectioning electronic components

       

    • Paste for component dipping

       

    • Solder alloys

       

    • Liquid fluxes

       

    • Wafer bumping

       

    • Low alpha solder

       

    • Spin coating

       

    • Redistribution layers (rdl)

       

    • Halogen-free

       

    • Flux viscosity

       

    • Solder paste viscosity

       

    • Whatever else you are interested in