Indium Corporation - Mailchimp

SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion

Category:
  • Videos
  • Solder Defects
  • SMT Solder

  • Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 on Wednesday, September 20 in the Show Floor Theater. The panel will be co-chaired by Eric Moen from Akrometrix, and features Alex Chan, Nokia; Martin Anselm, RIT; Raiyo Aspandiar, Intel; Dale Lee, Plexus; and Neil Hubble, Akrometrix.