SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion
Brook Sandy-Smith will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 ...
Solder Defects
SMTAI 2017: Warpage-Induced Defects Panel & Show Overview
Brook Sandy-Smith and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017 ...
Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...
Assessing Field Reliability and Defect Rates in Electronics Assembly
This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not statistical sampling ...
Pros and Cons of Convection Reflow Soldering using Nitrogen
Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....
In Soldering, Understanding the Cause and Cure for NWO (Non-Wet Opens)
Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them....
Lead Free 2015
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
Pareto Chart Your Data to Help in Continuous Improvement
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjo...
Preheating - An Introduction: Wave Soldering (A Segmented Synopsis) Post #9
Many of my posts have been discussing the different types of wave soldering fluxers: th...
Growing Interest in Bi-Containing Solder Alloys: Bismuth Rocks!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
Fluxers Part II - Wave: Wave Soldering (A Segmented Synopsis) Post #4
When the wave soldering machine was developed, the early flux application method was the same as the solder application method – a wave. While t...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...