Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...
This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not statistical sampling ...
Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....
Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them....
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjo...
Many of my posts have been discussing the different types of wave soldering fluxers: th...
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
When the wave soldering machine was developed, the early flux application method was the same as the solder application method – a wave. While t...
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
Folks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s sm...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...