Common Cause vs Special Cause Defects
Folks, In teaching process optimization and failure analysis, one of the most helpful concepts is understanding he difference between common cause and...
Folks, In teaching process optimization and failure analysis, one of the most helpful concepts is understanding he difference between common cause and...
Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow ......
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation’s technical staff. I asked Ed if he would share with us his tho...
Viscosity Versus Number of Prints Folks, Solder pastes are a very complex “fluid” of high viscosity. Their behavior, when experiencin...
How important is a solder joint? Most electronics contain hundreds or even thousands of them. Does that mean that it’s acceptable for...
Surprises are rarely a good thing in production. High quality spheres minimize those ‘surprises’ when building BGAs and......
One of the primary concerns with halogen-free solder pastes and fluxes revolves around the wetting and coalescence. The reason that halogens (usually ...
“A picture is worth a thousand words.” Reliability is worth even more…?xml:namespace prefix = o ns = "urn:schemas-micros...
Ok, so it happened again. Another urgent request was brought to me for action. This time it was a customer who had performed a Red Dye Penetration......
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Head-in-pillow defects caused by everything before the components go on-line can be grouped into Supply Issues. Some specific issues within this group...