Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux...
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or co...
Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, bu...
Folks, In my last post we saw how you could measure density with only a scale. In this post, we will expand on that technique and learn h...
In order to NanoBond® parts that are made out of copper, nickel, or platinum, we must first apply solder to the bonding surface. This......
Using NanoFoil®can be very easy, and there are many things you can do yourself to make prototyping or production easier, save money, and get the r...
One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux...
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as ...
Tin-coated NanoFoil® is not one, but two very different products, combined. It is a heat source and a form of solder. In the world of interconnect...
There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device p st...