A Method to Attach Indium Interfaces over Large Surface Areas
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Folks, A few days ago, I promised more from Tim Jensen on Halide-free soldering. Here it is: DR: There is a significant push in the electronics indust...
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and...
Folks, Intel announced that they now produce lead-free flip chip solder joints in their 45 nm technology. You will recall that flip chip solder joints...
Folks, Some have said that I am a fan of lead-free assembly. It’s not true. In a world drowning in electronic waste, I am a fan of re-cycling......
Folks, In continuing to ask friendly questions about the Occam Process, see the fictitious vignette that follows. Please feel free to share your thoug...
Folks, IBM annoounced production of its totally lead-free “C4” (controlled collapse chip connection) solder joint, C4NP. This announcement...
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and......
Folks, People in the solder and leadfree world still do not understand the prime reason for RoHS: To make recycling easier. A recent article about Swa...
Folks, I am giving an updated version of my one day workshop on WEEE/RoHS compliant assembly at The Thayer School of Enginnering at Dartmouth o...
Folks, Several companies have developed hand held units to aid in screening for RoHS compliance Let me start off by saying that I think such a unit wo...