Pin-in-Paste Aperture Calculations Using Solder Preforms with StencilCoach
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
New developments are happening almost daily in the electronics device world: phones that do much more than just convey voice, clothing that monitors a...
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...
Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability co...
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that In...
Have you ever found yourself knowing where you want to go, but not sure how to get there? This can be frustrating and time......
Solder seems pretty simple, and, honestly, it doesn’t always need to be overly technical. But, many SMT, semiconductor, thermal management, and ...