RoHS Medical "Per Homogeneous" Conclusion
Folks, Let’s see how Patty and Pete are doing with their Medical Device RoHS Crisis….. Patty and Pete sat in a plane on the runway of the...
Folks, Let’s see how Patty and Pete are doing with their Medical Device RoHS Crisis….. Patty and Pete sat in a plane on the runway of the...
Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the...
We have all seen the action movies where the hero drops in at the last minute to save the day against insurmountable odds. NanoFoil® is like...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Folks, A reader writes: Dear Dr. Ron, I need to measure the void content of an alloy. Is there an easy way to do it? After a little thoug...
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or co...
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics env...
NanoFoil® is a great localized heat source, but it can cause some ugly looking aesthetic defects if the process is not set up correctly. Let̵...
Folks, A while ago I discussed the Weibull Distribution and its importance in electronics reliability analysis. This distribution has been use...
It seems like a fairly simple thing to do. What could be difficult about soldering a wire to a pad? Well, I hear three common complaints a...
Folks, In the last posting, we saw how Weibull analysis helped us to determine that SACm® lead-free solder (SAC105 with about 0.1% manganese) has ...
Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let’s now derive the relationships needed to calculate the slop...