Lack of Data to Support "Tin Whiskers' Being Major Reliability Concern for Toyota
Folks, Bob Landman’s comments to my tin whisker posts appear below. Friendly dialogue such as this helps us to all learn more and is ...
Are Solder-Related Tin Whiskers Implicated in Toyota Sudden Acceleration Issues?
Folks, After my recent post on the fact that there was no data linking tin whiskers to the Toyota sudden acceleration issues, there continue to be m...
Solder Reflow Profiling Tips - Graping
Graping is a phenomenon which appears as un-reflowed solder particles, typically seen on the surface of the solder joint. &nbs...
Solder Bonding to Non-Metallics: Indium 101
If you look for indium on the periodic chart, you will see that it located right by tin (Sn) and lead (Pb) but it is a world away in terms of its prop...
Profiling Basics – Reflow Phases
Reflow profiling can be broken down into several phases. I generally use the following; Preheat Pre-reflow Reflow Cooling p style="margi...
Olympic Champions Rewarded with Gold, Silver, Bronze and Circuit Boards?
Have you been watching the Olympics? I knew I had been watching maybe TOO much of the Olympics when I heard that the medals were made from ...
NanoFoil® and the Grilled Cheese Incident
Having worked with NanoFoil® for over two years, I've tried just about every way possible to explain what it is, where it comes from, and why ...
Pb-Free Bar Solder Dilemma: Price vs. Performance
Many consumer electronics transitioned to Pb-Free 4-5 years ago. However, there are still a substantial number of electronics being built with S...