Metal Loading: Powder Size for Printing and Dispensing
At Indium Corporation, we get a lot of questions about solder paste - its composition, its application, and best practice advice. Many of those q...
At Indium Corporation, we get a lot of questions about solder paste - its composition, its application, and best practice advice. Many of those q...
Folks, To the SMT process engineer, the second most important thixotropic material in their lives is solder paste. If solder paste was not thixotropic...
Previously in this blog series, we discussed some of the best practices for attaching thermocouples to a printed circuit board (PCB) for reflow p...
As discussed in the previous blog of this series, it is important to remember the best practices for attaching thermocouples to a PCB to acc...
In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep in mind the best practices for attaching thermoco...
Durafuse® LT gives us even more options for low-temperature solder reflow, but thankfully just using consistent terminology can go a long way...
Exploring and explaining the 5-ball and 8-ball solder paste & stencil design rules in SMT assembly....
Durafuse® LT is a low-temperature solder with two different liquidus temperatures - one lower and one higher than the the peak reflow tempera...
Low temperature solder Durafuse® LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy....
The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetim...
New Durafuse® LT is a novel mixed alloy system designed to combine low temperature solder reflow with drop-shock performance similar to or be...