Does Solder Paste's "Five Ball Rule" Remain Valid in SMT Today?
Re-exploring solder paste's "five ball rule" in SMT stencil printing....
Re-exploring solder paste's "five ball rule" in SMT stencil printing....
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the&...
Indium Corporation’s Brook Sandy-Smith and Phil Zarrow outline good shipping practices. ...
In this installment, Phil reviews the initial steps in identifying the best solder paste to meet your needs. ...
In this installment of Tech Seconds, Phil discusses important considerations for selecting a solder paste supplier. ...
Phil Zarrow explains how to store the unused portion of an open container of solder paste, and what to do with the leftover solder paste that's al...
Indium Corporation’s Tech Seconds video series answers electronics assembly industry’s most commonly asked question in 60 seconds or less....
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-cl...
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types. ...
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller. ...
Material Comparisons for Soldering Process Issues. ...