Peter Borgesen Weighs in on Lead-Free Solder Reliability
Folks, I met Peter Borgesen back in the mid 1980s when he was a research scientist at Cornell working with Professor Che-Yu......
Field Data Encouraging for Lead-Free Solder Reliability
Folks, Although a few have suggested that lead-free reliability is an oxymoron, currently most people that have studied the reliability of SAC3...
Silver-free and Low-Silver Solder Alloys for SMT Discussion, Part 1: Reliability
There seems to be a growing trend to use a low-Ag or Ag-free solder alloy for Surface Mount Technology (SMT) electronics assembly, similar to what is ...
Bismuth Solder Alloy Follow On
Folks, A few people asked some questions after my last post on bismuth solders. Here they are:......
Tin Whiskers found in NASA Study of Toyota Unintended Acceleration Issue
Folks, Many people responded to my recent post, In Search of Tin Whisker Fails in Lead-Free Soldering. A few pointed out that the rece...
Lead-Free Soldering: Pluses and Minuses
Folks, I thought I would take a stab at listing the minuses, pluses, and “it’s a wash” aspects of assembling with lead-free (LF) sol...
Status of Lead-Free Solder Joint Reliability in Thermal Cycle Testing
Folks, Back in October, I posted comments on lead-free reliability. In this post, I mentioned that I chaired a session at SMTAI on “...
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...
Transitioning from Water-Soluble Solder Paste Flux to No-Clean Solder Paste Flux
I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found o...