Saving a House or Losing a Mansion?
Folks, The adventures of Patty and The Professor continue….. Patty and The Professor agreed to work with two of the local process engineers to...
Folks, The adventures of Patty and The Professor continue….. Patty and The Professor agreed to work with two of the local process engineers to...
Once the flux has been formulated and scaled up it then must be mixed with solder powder. The mixing procedure and equipment must be capable of provid...
The second main ingredient in solder paste is the flux (vehicle). Flux is a very complex group of chemicals/materials that must be able to do a number...
Folks, Recently, I ran into The Professor. He graciously agreed to an interview. The following is the discussion from our meeting....
I polled some of our field sales force to find out what common questions customers ask them. You (the reader) probably have similar questions.&n...
Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow ......
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Viscosity Versus Number of Prints Folks, Solder pastes are a very complex “fluid” of high viscosity. Their behavior, when experiencin...
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
Folks, Last week Indium Corp held its annual Technology Summit. There were many excellent technical presentations. Chris Anglin’s br...
Lets talk about some issues… The first thing that I am worried about is......