IGBT Assembly - Indium8.9LDA Solder Paste
The Insulated Gate Bipolar Transistor (IGBT) module is rapidly taking over from MOSFET technology as the solid-state power switch of choice. Die-attac...
Enlist the Experts before Choosing a Solder Alloy for Chip Attach
A few of Indium’s solder experts ready to assist. I am well aware that many of you are now working in stressed out, short-handed workplaces and ...
What flux do you use for indium?
Don’t’ expect a simple answer – that depends on your application. span......
Indium and Flip Chip Bonding
Photo courtesy Optocap Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer…br......
Predictions for 2009: Advanced Packaging
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Solderability Testing of Die-Attach Solder Paste
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
Advanced Solder Paste is Key to Improving QFN Reliability
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
Surface Preparation for Flux-less Reflow – The Solution
I can’t promise that every gold-indium or copper-indium soldering process can work without a flux, but there are tricks to give you a better cha...
Examine the Oxygen Bomb Test Report Carefully!
Indium Corporation is a big proponant of using the EN14582 oxygen bomb test method for halogen determination. However, we have seen misleading r...
Miniaturization Creates Single Solder Grain Concern
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...