Intermetallic Growth
Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an...
Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an...
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced ...
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can l...
Head-in-pillow defects caused by everything before the components go on-line can be grouped into Supply Issues. Some specific issues within this group...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....