Occam Webinar Adds Little New
Folks, I attended Verdant’s Occam Webinar yesterday. Verdant’s Joe Fjelstad was the speaker. As the webinar began, I was reminded what a n...
Folks, I attended Verdant’s Occam Webinar yesterday. Verdant’s Joe Fjelstad was the speaker. As the webinar began, I was reminded what a n...
Folks, In continuing to ask friendly questions about the Occam Process, see the fictitious vignette that follows. Please feel free to share your thoug...
Lisme writes, Hi Dr. Lasky, As tin is the major material used in lead free soldering, and it’s source is decreasing each year, is there any pred...
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application,...
Folks, IBM annoounced production of its totally lead-free “C4” (controlled collapse chip connection) solder joint, C4NP. This announcement...
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing “tombstoning” of passives at a major el...
Folks, There has recently been concern over the raising price of commodities (e.g.: copper, tin, silver, gold, cement, steel, oil, lumber, etc). So it...
Folks, I recently received this note: Hello Dr. Ron, A colleague of mine sent me the following article. I’m about to start the Pb-Free imple...
Folks, The EU is currently assessing the effect of WEEE/RoHS on industry. A recent article from EDN discusses this interesting topic. To no one’...
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and......
Folks, David asks: I am the Process Engineer at a small contract electronics firm and I could use some help. I have been asked to find out what kinds ...
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to shar...