Design Considerations for the NanoBond® Process
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
To successfully use NanoFoil®, you do not need to fully understand what it is or how it is made, although that does help. It also makes for a...
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickn...
Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN’T want to see THAT, right?!? Fl...
The Indium Corporation has developed a new solder research kit designed specifically to meet the needs of medical manufacturers who are soldering to N...
Folks, Let’s see how Patty and Pete are making out on their latest adventure…. “Here is the ProfitPro™ output,” Dave...
It is summer time again in the Northern Hemisphere and many places, especially in North America, are experiencing record heat. It also seems that most...
Folks, It has been a while, let’s look in on Patty…... Patty had to admit that she was very fortunate. She had yet to t...
About a month ago I posted about the various 3D technologies (chip creation, packaging and printed circuit boards) that are being used to op...