Miniaturization Creates Single Solder Grain Concern
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...
Rick Short shaving my head for charity So why Blog? Whatever I choose to call this thing that you are currently reading, it’s a Blog. But what.....
For our second guest blogger i would like to introduce Dr. Harald Wack, President of Zestron. Zestron is manufacturer of flux residue cleaners a...
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation’s technical staff. I asked Ed if he would share with us his tho...
Have you ever had a hard time getting help with something? For the last year I’ve been searching......
I’m glad to mention a new application note has been added to our database. This recent addition deals......
Viscosity Versus Number of Prints Folks, Solder pastes are a very complex “fluid” of high viscosity. Their behavior, when experiencin...
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...
Proper solder joints provide mechanical, electrical, and thermal interconnections that are reliable over the course of a product’s lifespan. spa...
Following the success of NC-506 (No-Clean flux for mounting spheres on BGA packages) is a halogen-free version – NC-585.span......