Ultra Low Res Flip Chip Flux
This is just an ultra low resolution picture of flip chip attachment flux, however ultra low residue flip chip attachment flux is clearly a great solu...
This is just an ultra low resolution picture of flip chip attachment flux, however ultra low residue flip chip attachment flux is clearly a great solu...
Folks, We are all aware that the miniaturization of electronics continues unabated. As consumers we benefit from this phenomenon, as electronic assemb...
Bob Jarrett gave an excellent explanation of the thermal conductivity of metal alloys and their relationship with electrical conductivity. It is as fo...
Ok, so it happened again. Another urgent request was brought to me for action. This time it was a customer who had performed a Red Dye Penetration......
Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an...
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can l...
Head-in-pillow defects caused by everything before the components go on-line can be grouped into Supply Issues. Some specific issues within this group...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....